Heat dissipation mechanism for electronic equipment

A heat dissipation mechanism and technology for electronic equipment, applied to the structural components of portable computers, electrical digital data processing, instruments, etc., can solve the problems of affecting user experience, obstruction of charging lines, single heat dissipation method, etc., and achieve good heat absorption and heat dissipation effects , the effect of heat balance

Inactive Publication Date: 2021-05-11
西安发威电子科技有限公司
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Problems solved by technology

[0004] The purpose of the present invention is to provide a heat dissipation mechanism for electronic equipment, so as to solve the problem that the charging line and the hand usually obstruct each othe

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  • Heat dissipation mechanism for electronic equipment
  • Heat dissipation mechanism for electronic equipment
  • Heat dissipation mechanism for electronic equipment

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[0020]Next, the technical solutions in the embodiments of the present invention will be apparent from the embodiment of the present invention, and it is clearly described, and it is understood that the described embodiments are merely embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, there are all other embodiments obtained without making creative labor without making creative labor premises.

[0021]SeeFigure 1-4The present invention provides a technical solution: a heat dissipation mechanism for an electronic device, including a main fixing plate 1, a handle 2, a storage frame 3, a threaded hole 4, a bolt 5, a sliding tank 6, a right angle snap 7, sponge soft Pad 8, heat dissipation copper plate 9, circulating water tank 10, heat dissipation fan 11, protective outer frame 12, limit pallet 13, charging adapter opening 14, charging guide wire 15 and charging access port 16, main fixing plate 1 outer wall underside Handl...

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Abstract

The invention discloses a heat dissipation mechanism for electronic equipment which comprises a main fixing plate and a protective outer frame; handles are arranged on two sides of the lower end of the outer wall of the main fixing plate, a storage frame is connected to the upper end of the main fixing plate, a threaded hole penetrates through the outer wall of the storage frame, a bolt is mounted on the inner wall of the threaded hole, a sliding groove is attached to the outer wall of the tail end of the bolt, and a heat dissipation device is arranged in the sliding groove. A right-angle buckle is arranged on the outer wall of the sliding groove, a sponge cushion is attached to the tail end of the right-angle buckle, heat dissipation copper plates are attached to the two sides of the inner wall of the main fixing plate, and a heat dissipation fan is attached to one side of the outer wall of each heat dissipation copper plate. The heat dissipation mechanism of the electronic equipment is provided with the heat dissipation copper plates, wherein copper is adopted as a main material, so that good heat absorption and heat dissipation effects can be achieved; the heat dissipation copper plates clamp the heat dissipation fan to play a role in heat collection and heat dissipation, meanwhile, cooling water needs to be injected into the inner wall of the circulating water tank, heat balance of the two heat dissipation copper plates is achieved in a liquid cooling mode, and thereby an auxiliary heat dissipation effect is achieved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation devices for electronic equipment, in particular to a heat dissipation mechanism for electronic equipment. Background technique [0002] With the rapid development of economy and the advancement of science and technology in various regions, electronic equipment has gradually penetrated into the daily life of each of us. Good electronics provide a comfortable way to dissipate heat. [0003] When electronic devices on the market are playing games or in other situations, the charging cable and the hand usually obstruct each other, which affects the experience of use. At the same time, only wind energy is the only way to dissipate heat. Therefore, we propose a heat dissipation mechanism for electronic devices . Contents of the invention [0004] The purpose of the present invention is to provide a heat dissipation mechanism for electronic equipment, so as to solve the problem that the char...

Claims

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Application Information

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IPC IPC(8): G06F1/20G06F1/16
CPCG06F1/1613G06F1/20
Inventor 叶晴
Owner 西安发威电子科技有限公司
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