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Redistribution layer structure and semiconductor package

A rewiring layer, semiconductor technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as increasing production costs, and achieve the effect of reducing the number and reducing production costs

Active Publication Date: 2021-05-11
NAN YA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since different redistribution layers need to be fabricated using multiple different masks, the production cost increases

Method used

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  • Redistribution layer structure and semiconductor package
  • Redistribution layer structure and semiconductor package
  • Redistribution layer structure and semiconductor package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] figure 1 It is a top view of a redistribution layer structure according to an embodiment of the present invention.

[0046] Please refer to figure 1 The redistribution layer structure 100 includes a pad 102a, a pad 102b, a pad 102c, a pad 102d, a switch element 104a, a switch element 104b, a switch element 104c, and a switch element 104d. The redistribution layer structure 100 is, for example, a redistribution layer layout pattern.

[0047] The pad 102a, the pad 102b, the pad 102c and the pad 102d are separated from each other. In this embodiment, the pads 102a and 102b can be used as die pads, and the pads 102c and 102d can be used as solder pads, but the present invention does not take this as an example. limit. In addition, the pads 102a and 102b are, for example, located between the pads 102c and 102d, but the invention is not limited thereto. Those skilled in the art can adjust the arrangement of the pads 102a, 102b, 102c, and 102d according to product design....

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PUM

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Abstract

The invention provides a redistribution layer structure. The redistribution layer structure includes a first pad, a second pad, a third pad, a fourth pad, a first switch device, a second switch device, a third switch device, and a fourth switch device is provided. The first pad, the second pad, the third pad, and the fourth pad are separated from each other. The first switch device includes a first conductive layer and a second conductive layer separated from each other. The second switch device includes a third conductive layer and a fourth conductive layer separated from each other. The third switch device includes a fifth conductive layer and a sixth conductive layer separated from each other. The fourth switch device includes a seventh conductive layer and an eighth conductive layer separated from each other. The redistribution layer structure can effectively reduce the production cost.

Description

technical field [0001] The present invention relates to a semiconductor structure, in particular to a redistribution layer (redistribution layer, RDL) structure and semiconductor package. Background technique [0002] In order to realize thin, light and small features in electronic product design, semiconductor packaging technology continues to advance in an attempt to develop products with smaller volume, lighter weight, higher integration and higher competitiveness in the market. For example, in some products, if the package requires stacking of multiple dies, multiple different redistribution layers are often required to provide the connections. However, since different redistribution layers need to be manufactured using a plurality of different photomasks, the production cost will be increased. Contents of the invention [0003] The invention provides a rewiring layer structure and a semiconductor package, which can effectively reduce the production cost. [0004] Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488H01L23/498H01L23/52H01L23/538
CPCH01L23/488H01L23/49838H01L23/52H01L23/5386H01L23/3121H01L23/525H01L2224/48091H01L2224/16145H01L2224/48227H01L24/05H01L2224/73207H01L24/06H01L2224/0603H01L2224/13028H01L24/13H01L2924/181H01L2224/13082H01L2224/13147H01L2224/13101H01L2924/00014H01L2224/05569H01L24/16H01L24/48H01L2924/00012H01L2924/014H01L2224/45099H01L23/49816H01L23/49811
Inventor 杨吴德
Owner NAN YA TECH
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