Separated heat exchange module and composite thin-layer heat conduction structure
A technology of heat exchange module and heat conduction structure, which is applied in the direction of layered products, metal layered products, electrical equipment structural parts, etc., can solve the problems of non-ductility, difficult combination, difficult post-processing, etc., and avoid easy damage Effect
Active Publication Date: 2021-05-11
ACER INC
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Problems solved by technology
In addition, graphene materials can also be used as heat-conducting media. However, due to the mechanical properties of graphene materials, its structure is brittle and non-ductile, so it is difficult to post-process it, and it is not easy to integrate with common heat dissipation components in electronic devices. to combine
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[0033] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.
[0034] figure 1 It is a schematic diagram of a separate heat exchange module according to an embodiment of the present invention, which provides a simple illustration of relevant components of this embodiment from a side view angle. Please refer to figure 1 , in this embodiment, the separate heat exchange module 100 is used to dissipate heat from the heat source 200 . The separated heat exchange module 100 includes a first heat conduction element 110, a second heat conduction element 120, and a heat dissipation element 130, wherein the first heat conduction element 110 is in thermal contact with the heat source 200, and the second heat conduction element 120 is in thermal contact with the...
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Abstract
The invention provides a separated heat exchange module and a composite thin-layer heat conduction structure, which are used for dissipating heat of a heat source, and the separated heat exchange module comprises a first heat conduction member, a second heat conduction member and a heat dissipation member. The first heat conduction piece comprises a first metal layer, a second metal layer and a graphene layer, the graphene layer is located between the first metal layer and the second metal layer, and the first metal layer is in thermal contact with a heat source. The second heat-conducting member has a first end and a second end opposite to each other, and the first end is in thermal contact with the second metal layer. The heat sink is in thermal contact with the second end. Heat generated by the heat source is transmitted to the second end through the first end of the first heat conduction piece and the first end of the second heat conduction piece in sequence, and is dissipated out of the separated heat exchange module through the heat dissipation piece.
Description
technical field [0001] The invention relates to a heat dissipation module and a heat conduction structure, in particular to a separate heat exchange module and a composite thin-layer heat conduction structure. Background technique [0002] At present, various electronic devices such as portable computers, tablet computers, smart phones, navigators and other equipment are becoming more and more powerful, the instruction cycle is getting faster and faster, and the size is getting smaller and smaller. Hotspots are becoming more and more concentrated. Therefore, in order to maintain a good operating performance of the electronic device, it is more important to design the heat dissipation thereof. [0003] Generally speaking, various heat dissipation materials are widely used in these electronic devices, and different types of heat dissipation materials have different properties. For example, metal materials such as copper, aluminum, silver, etc. are commonly used due to their ...
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IPC IPC(8): H05K7/20
CPCH05K7/2039H05K7/20154H05K7/20172G06F1/203B32B7/12B32B9/007B32B3/08B32B2307/724B32B2250/40B32B2457/00B32B2307/732B32B2307/72B32B3/04B32B2307/302B32B7/08B32B2307/538B32B9/041B32B2250/03H05K7/20136B32B15/04
Inventor 林光华廖文能
Owner ACER INC