Automatic RFID Wafer returning device

Abstract

The invention discloses an automatic RFID Wafer returning device. The device comprises a shell, a quick connector, a first mounting plate, a second mounting plate, an in-place sensor, a push rod, a lower cavity, an upper cavity, a guide shaft, an in-place block, a sealing ring, a guide pin, a guide pin supporting block and an in-place pin, wherein the quick connector is installed at the bottom of the shell, the sealing ring is installed in a groove in the bottom of the guide shaft, the guide shaft is installed in the shell, the first mounting plate and the second mounting plate are mounted on the two sides of the shell, the guide pin supporting block is mounted on the top of the shell, and the guide shaft is mounted in the shell and the guide pin supporting block. According to the automatic RFID Wafer returning device, the problems are effectively solved, operation is convenient, the device can be compatible with Wafer material trays of different sizes, in this way, the use cost and the maintenance cost of a user side are effectively saved, convenience is provided for upgrading of future products, and better use prospects are brought.

Description

technical field [0001] The invention relates to the field of RFID Wafer automatic material return, in particular to an RFID Wafer automatic material return device. Background technique [0002] RFID Wafer automatic material return device is a supporting device for DDD. With the rapid development of the RFID industry, there are more and more types of chips, and the types of die bonders are also increasing. The efficiency improvement has become a The important competitive advantage of the machine, the improvement of the chip removal efficiency is of great help to the improvement of the overall efficiency of the die bonder. With the continuous development of technology, people have higher and higher requirements for the manufacturing process of the RFID Wafer automatic material removal device. [0003] The existing RFID Wafer automatic return device has certain disadvantages in use. Due to the assembly limitation of the wafer tray of the die bonder, the installation space of th...

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Problems solved by technology

[0003] The existing RFID Wafer automatic return device has certain disadvantages in use. Due to the assembly limitation of the wafer tray of the die bonder, the installation space of the return device is limited. The traditional return device is not simple and light, and it is not easy to change the type. , it is very difficult to return the wafer, which is not conducive to people's use, and has brought certain adverse effects to people's use process. Therefore, we propose an RFID Wafer automatic return device

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