QFN chip image acquisition device and image acquisition method thereof

Abstract

The invention provides a QFN chip image acquisition device and an image acquisition method thereof, and the device comprises an X-axis servo motion sliding table device, a Y-axis servo motion sliding table device, a Y-axis auxiliary motion sliding table device, a Z-axis hand-operated motion sliding table device, a camera, a lens, a light source, a charging tray clamp, a rack and an upper computer. The upper computer is in serial port communication with the PLC and the camera through communication lines and is used for sending a control instruction to the PLC, so that the PLC controls the X-axis servo motion sliding table device and the Y-axis servo motion sliding table device to work, the camera is controlled to move in the X-axis direction and the Y-axis direction, and QFN chip images collected by the camera are obtained. The device can carry out continuous and high-precision image acquisition on the QFN chip in the charging tray, movement is completed at the speed of 12mm / s, the detection resolution of characters on the surface of a shot chip image reaches 20 microns, detailed feature information of the surface of the chip can be effectively obtained, and a certain basis is provided for chip surface defect detection.

Description

technical field [0001] The invention relates to the technical field of detection, in particular to a QFN (Quad Flat No-lead Package, square flat no-lead package) chip image acquisition device and an image acquisition method for the QFN chip image acquisition device. Background technique [0002] QFN is a surface-mount chip packaging technology that is small in size, light in weight, and uses plastic as a sealing material. The conductive path between the internal pins and the pads of the QFN package is short, the wiring resistance is very low, and it has excellent electrical properties, and the pads have direct heat dissipation channels, and the heat dissipation is good. QFN packaging technology is widely used in mobile phones, digital cameras and other portable devices. High-density printed circuit boards for small electronic devices. However, due to factors such as production technology and environment, cracks, foreign objects, scratches, holes and other defects will appea...

AI Technical Summary

Problems solved by technology

[0003] In related technologies, the method of manually detecting chips is generally used. This method has low detection efficiency and poor reliability, and cannot meet the continuous and high-precision detection requirements of QFN chip packaging and testing.

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