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Conductive adhesive multi-layer material assembling and pasting technology

A multi-layer material, conductive adhesive technology, applied in the direction of lamination, lamination device, layered products, etc., can solve the problems of poor product stability, high cost, low production efficiency, etc., and achieve high processing efficiency and high production efficiency. , The effect of strong product quality stability

Pending Publication Date: 2021-05-28
东莞六淳智能科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copper foil conductive tape is generally made of multi-layer materials. The production process of copper foil conductive tape in the prior art is generally to produce multiple materials separately according to the required requirements, and then paste and assemble the multi-layer materials. Low production efficiency, poor product stability, low product yield and high cost due to the lamination of individual materials one by one

Method used

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  • Conductive adhesive multi-layer material assembling and pasting technology
  • Conductive adhesive multi-layer material assembling and pasting technology
  • Conductive adhesive multi-layer material assembling and pasting technology

Examples

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specific Embodiment 1

[0022] Specific Example 1: See Figure 1 to Figure 6 , in an embodiment of the present invention, a conductive adhesive multi-layer material assembly process includes the following steps:

[0023] Step S1, attaching the bottom surface of the blue film 2 to the first row of waste films 1, attaching the top surface of the blue film 2 to the first cover film 3, performing the first die-cutting, and cutting the blue film 2 in shape, The material is punched into the first row of waste film 1 continuously, and the first positioning hole 101 is also punched at the same time. The material at the position of the first positioning hole 101 is completely broken, and the waste is discharged after the first punching is completed. The blue film 2 is a single The surface is sticky, and the sticky surface on the blue film 2 is attached to the first cover film 3;

[0024] Step S2, tearing off the first cover film 3, attaching the single-sided adhesive 4 to the top surface of the blue film 2, ...

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Abstract

The invention provides a conductive adhesive multi-layer material assembling and pasting technology which comprises the following steps that: a punching part A with a first positioning hole and a punching part B with a second positioning hole are prepared, and then the punching part A and the punching part B are positioned and pasted through a pasting jig. The assembling and pasting technology provided by the invention realizes the assembling and pasting of multiple products at the same time, the positioning accuracy among multiple layers of materials is high, the production efficiency is improved, and the stability of product production is ensured.

Description

technical field [0001] The invention relates to the technical field of die-cutting products, in particular to a process for assembling conductive adhesive multi-layer materials. Background technique [0002] Copper foil conductive tape is a kind of metal tape, which is widely used in electronic products for electromagnetic shielding. Copper foil conductive tape is generally made of multi-layer materials. The production process of copper foil conductive tape in the prior art is generally to produce multiple materials separately according to the required requirements, and then paste and assemble the multi-layer materials. The production efficiency is low, and the one-by-one bonding of individual materials results in poor product stability, low product yield, and high cost. Contents of the invention [0003] The object of the present invention is to provide a conductive adhesive multi-layer material assembly process to solve the technical problems in the background technolog...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B38/04
CPCB32B37/12B32B38/04B32B2038/042B32B2038/047
Inventor 莫舒润张必亮
Owner 东莞六淳智能科技股份有限公司