Vacuum bonding curing device and curing method for panel components
A technology of curing device and panel assembly, applied in the direction of connecting components, material gluing, mechanical equipment, etc., can solve problems such as rework of adhesive layer, achieve the effect of reducing energy consumption, ensuring thickness consistency, and reducing the probability of rework
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[0031] The present application is described below based on examples, but the present application is not limited only to these examples. In the following detailed description of the application, some specific details are described in detail, and in order to avoid obscuring the essence of the application, known methods, procedures, processes, and components are not described in detail.
[0032] Additionally, those of ordinary skill in the art will appreciate that the drawings provided herein are for illustrative purposes and are not necessarily drawn to scale.
[0033] Unless the context clearly requires, throughout the specification and claims, "comprises", "comprises" and similar words should be interpreted in an inclusive sense rather than an exclusive or exhaustive meaning; that is, "including but not limited to" meaning.
[0034] In the description of the present application, it should be understood that the terms "first", "second" and so on are used for descriptive purpos...
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