Over-temperature protection test method, system and device for chip and medium

Abstract

The invention discloses an over-temperature protection test method for a chip. The method comprises the steps of heating the temperature of an air duct outlet to a maximum value at which the chip can work normally in response to hot air generated by a heating device according to a first heating parameter, dynamically adjusting the first heating parameter according to the temperature of the air duct outlet, and keeping the temperature of the air duct outlet at the maximum value; in response to the fact that the chip temperature reaches the maximum value, controlling the heating device to generate hot air according to a second heating parameter; in response to the situation that the air duct outlet temperature rises to a preset value larger than the maximum value, dynamically adjusting the second heating parameter according to the temperature of the air duct outlet, so that the temperature of the air duct outlet is kept at the preset value; and responding to the chip to trigger over-temperature protection, acquiring the temperature of the chip at the moment, and associating the temperature with the preset value to serve as experimental data. The invention further discloses a system, computer equipment and a readable storage medium.

Description

technical field [0001] The invention relates to the testing field, in particular to a chip over-temperature protection testing method, system, equipment and storage medium. Background technique [0002] First of all, the traditional OTP test mainly relies on the experience of the testers to control the wind speed and temperature of the heat gun, and it is impossible to customize the heat conduction scheme according to the specific chip information of the VR to be tested; secondly, due to individual differences in the air gun equipment and environment, it is impossible to ensure the actual The actual wind speed and temperature of the hot air blowing towards VR are the same as the set value; there is no effective monitoring of the surface environment temperature of the chip under test, and it is impossible to perform feedback adjustment according to the actual test state during the test. In terms of data measurement, the traditional OTP method, whether using an infrared thermo...

AI Technical Summary

Problems solved by technology

[0002] First of all, the traditional OTP test mainly relies on the experience of the testers to control the wind speed and temperature of the heat gun, and it is impossible to customize the heat conduction scheme according to the specific chip information of the VR to be tested; secondly, due to individual differences in the air gun equipment and environment, it is impossible to ensure the actual The actual wind speed and temperature of the hot air blowing to VR are the same as the set value; there is no effective monitoring of the surface environment temperature of the chip under test, and it is impossible to perform feedback adjustment according to the actual test status during the test

In terms of data measurement, the traditional OTP method, whether using an infrared thermometer or sticking a temperature measuring line, cannot accurately read the temperature value at the moment of over-temperature protection, and due to the temperature difference between the ambient temperature and the junction temperature, the VR In a dynamic cooling or heating system, the temperature has changed when the reading is delayed

Therefore, the accuracy is lower

And because the traditional method requires the tester to hold a heat gun, there are cases of uneven heating and even damage to other components on the board during heating

There will be a chance to affect the OTP circuit

For example, if the filter capacitor connected in series on the OTP Pin is damaged, it will have a negative impact on the OTP determination of the VR chip, thus affecting the accuracy

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