Micro-led display and manufacturing method thereof
A LED display and miniature technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems affecting the optical and electrical properties of the LED structure, the peeling off of the micro LED mesa, and the weak adhesion of the micro LED mesa
Active Publication Date: 2022-04-22
RAYSOLVE OPTOELECTRONICS (SUZHOU) CO LTD
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Problems solved by technology
However, when a conventional micro LED mesa is transferred onto a substrate or after being transferred to a substrate such as a driving circuit substrate, a completely isolated functional micro LED mesa may be easily peeled off from the substrate due to the weak adhesion of the micro LED mesa.
This problem gets worse as Micro LED mesa gets smaller
Furthermore, during the conventional etching process used to isolate the Micro-LED mesas, the sidewalls of the Micro-LED mesas may be damaged and affect the optical and electrical properties of the LED structure.
Method used
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[0022] While specific configurations and arrangements are discussed, it should be understood that this is done for illustration purposes only. Accordingly, other configurations and arrangements may be used without departing from the scope of the present invention. Moreover, the present invention may be employed in a variety of other applications as well. The functions and structural features described in the present invention may be combined, adjusted and modified with each other and in various ways not specifically shown in the drawings, so that these combinations, adjustments and modifications are within the scope of the present invention.
[0023] In general, terms can be understood at least in part from contextual usage. For example, the term "one or more" as used herein may be used to describe any component, structure or feature in the singular or a combination of components, structures or features in the plural, depending at least in part on the context. Similarly, ter...
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Abstract
The invention relates to a micro-LED display, which includes a substrate, a bonding layer, a first doped semiconductor layer, a multiple quantum well layer (MQW layer), a second doped semiconductor layer, a passivation layer and an electrode layer. A bonding layer is formed on the substrate, and a first doped semiconductor layer is formed on the bonding layer. The MQW layer is formed on the first doped semiconductor layer, and the second doped semiconductor layer is formed on the MQW layer. The second doping type semiconductor layer includes an isolation material made by ion implantation, and a passivation layer is formed on the second doping type semiconductor layer. The electrode layer is formed on the passivation layer and is in contact with a part of the second doped semiconductor layer through the first opening on the passivation layer.
Description
[0001] Cross References to Related Applications [0002] This application claims the benefit of priority to U.S. Provisional Patent Application No. 63 / 007,831, entitled "Ion-implanted Micro-LEDs," filed April 9, 2020, the disclosure of which is hereby incorporated by reference incorporated as a whole. technical field [0003] The present invention relates to a light emitting diode (LED) structure and a method of manufacturing the LED structure, and more particularly, to an LED structure having a plurality of LED units surrounded by an isolation layer and a method of manufacturing the same. Background technique [0004] In recent years, LEDs have become popular in lighting applications. As a light source, LEDs have many advantages, including higher light efficiency, lower energy consumption, longer lifetime, smaller size, and faster switching speed. [0005] Displays with tiny sized LEDs are called micro-LEDs. Micro LED displays have an array of tiny LEDs forming a single ...
Claims
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IPC IPC(8): H01L33/06H01L33/38H01L33/00H01L33/44
CPCH01L33/06H01L33/382H01L33/005H01L33/44H01L33/62H01L33/0093H01L33/025H01L33/385H01L27/156H01L25/0753H01L33/08H01L33/38H01L33/486H01L33/0075H01L27/1259H01L33/20H01L2933/0016H01L2933/0066H01L2933/0025
Inventor 庄永漳
Owner RAYSOLVE OPTOELECTRONICS (SUZHOU) CO LTD