Ultra-low absorption double-sided anti-reflection film in ultraviolet band and preparation method thereof
A technology of ultraviolet band and anti-reflection coating, which is applied in the direction of optical components, instruments, optics, etc., can solve the problems that the service life and use effect of the lens cannot meet the requirements of customers, and the absorption of the film layer is large.
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Embodiment 1
[0041] like figure 1 As shown, an ultra-low absorption double-sided anti-reflection coating in the ultraviolet band has a structure of
[0042] Air / LHLHLHLH / Sub / HLHLHLHL / Air, where H stands for SiO 2 Film layer, the thickness is 63mm, L stands for MgF 2 The film layer has a thickness of 60mm, Sub represents the substrate, the thickness of the substrate is 5mm, and the material is fused silica.
[0043] The preparation method of the above-mentioned antireflection film comprises the following steps:
[0044] (1) Substrate heating: Wipe the substrate with a degreased gauze dipped in a 3:1 mixture of absolute ethanol and ether, then clean the substrate by ultrasonic cleaning, and then bake and heat the substrate in a vacuum state to increase the substrate temperature. Among them, the baking temperature is 160 ℃ ~ 170 ℃, and the baking time is 1.5 hours;
[0045](2) Ion beam cleaning: ion beam cleaning is performed on the substrate, the ion cleaning time is 2min, the ion beam v...
Embodiment 2
[0055] like figure 2 As shown, an ultra-low absorption double-sided anti-reflection coating in the ultraviolet band has the structure:
[0056] Air / 1.06L0.63H1.27L0.66H / Sub / 0.66H1.27L0.63H1.06L / Air, the theoretical thickness of each layer is 36.84 / 81.84 / 35.17 / 68.3 / Sub / / 68.3 / 35.17 / 81.84 / 36.84nm, among which , H stands for LaF 3 Film layer, L stands for AlF 3 For the film layer, Sub represents the substrate, the thickness of the substrate is 5mm, and the material is sapphire.
[0057] The preparation method of the above-mentioned antireflection film comprises the following steps:
[0058] (1) Substrate heating: Wipe the substrate with a degreased gauze dipped in a 3:1 mixture of absolute ethanol and ether, then clean the substrate by ultrasonic cleaning, and then bake and heat the substrate in a vacuum state to increase the substrate temperature. Among them, the baking temperature is 160 ℃ ~ 170 ℃, and the baking time is 1.5 hours;
[0059] (2) Ion beam cleaning: ion beam ...
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