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Chip transfer head and manufacturing method thereof, die bonder and chip transfer method

A technology of chip transfer and manufacturing method, which is applied in the manufacture of conveyor objects, electric solid-state devices, semiconductor/solid-state devices, etc.

Active Publication Date: 2022-05-13
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In view of the deficiencies of the above-mentioned related technologies, the purpose of this application is to provide a chip transfer head and its manufacturing method, a solid crystal machine and a chip transfer method, aiming at solving the problem of uneven stress on the chip during the transfer process of the LED chip in the related technology and releasing the chip. Inconsistent timing problem

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  • Chip transfer head and manufacturing method thereof, die bonder and chip transfer method
  • Chip transfer head and manufacturing method thereof, die bonder and chip transfer method
  • Chip transfer head and manufacturing method thereof, die bonder and chip transfer method

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Embodiment Construction

[0042] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Preferred embodiments of the application are shown in the accompanying drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the application more thorough and comprehensive.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terminology used herein in the description of the application is only for the purpose of describing specific embodiments, and is not intended to limit the application.

[0044] related technologies, such as figure 1 As shown, the vacuum suction head ...

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Abstract

The invention relates to a chip transfer head and a manufacturing method thereof, a solid crystal machine and a chip transfer method. The chip transfer head includes a negative pressure device; the vacuum suction head is arranged on the negative pressure device, and the suction nozzle hole of the vacuum suction head is connected with the negative pressure device; the suction nozzle hole is filled with porous material; the end of the vacuum suction head away from the negative pressure device covered with porous material. The suction force generated by the negative pressure device is dispersed and transmitted to the chip through the porous material, so that the chip attached to the porous material is evenly stressed, which can avoid direct contact between the vacuum suction head and the chip, thereby avoiding uneven force on the chip when sucking the chip lead to the problem of fragmentation; at the same time, when the chip is released, since the porous material disperses and transmits the suction force to the chip, when the chip is released, the consistency of the chip in the Y-axis direction, that is, the vertical direction, will be better, avoiding the The uneven force on the chip leads to inconsistent angles when releasing the chip.

Description

technical field [0001] The invention relates to the field of semiconductor devices, in particular to a chip transfer head and a manufacturing method thereof, a solid crystal machine and a chip transfer method. Background technique [0002] Mini Light Emitting Diode (Mini-LED) display technology is based on inorganic semiconductor light-emitting diode (Light-emitting diode, LED), a new display technology with lamp bead spacing between 0.6-1.2mm; Mini-LED can be applied to Ultra-large screen high-definition display, such as monitoring and command, high-definition broadcasting, high-end theaters, medical testing and other professional fields or outdoor advertising, conferences and exhibitions, office display and other commercial fields; Mini-LED display technology has high brightness, high response speed, low power consumption, Long life and other advantages have become a research hotspot for people to pursue a new generation of display technology. During the process of manufa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/677H01L21/67H01L33/48H01L27/15
CPCH01L21/6838H01L21/67706H01L21/67721H01L21/6773H01L21/67736H01L21/67144H01L33/48H01L27/156H01L2933/0033
Inventor 翟峰
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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