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Semiconductor cleaning equipment and wafer cleaning method

A technology for cleaning equipment and semiconductors, which is applied in the fields of cleaning methods using liquids, cleaning methods and utensils, semiconductor/solid-state device manufacturing, etc., which can solve problems such as poor cleaning effect of wafers, and achieve good cleaning effect and high cleaning uniformity.

Active Publication Date: 2022-07-22
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention discloses a semiconductor cleaning equipment and a wafer cleaning method, in order to solve the problem that the wafer cleaning effect of the semiconductor cleaning equipment is poor at present

Method used

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  • Semiconductor cleaning equipment and wafer cleaning method
  • Semiconductor cleaning equipment and wafer cleaning method
  • Semiconductor cleaning equipment and wafer cleaning method

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Embodiment Construction

[0027] In order to make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] The technical solutions disclosed by the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0029] like Figure 1-Figure 6 As shown, the embodiment of the present invention discloses a semiconductor cleaning device, and the semiconductor cleaning device can be used to clean the wafer 300...

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PUM

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Abstract

The invention discloses a semiconductor cleaning equipment and a wafer cleaning method. The semiconductor cleaning equipment includes a cleaning tank and a transducer vibration plate arranged in the cleaning tank. The transducer vibration plate includes a vibration plate body and a plurality of oscillator groups. , each of the vibrator groups includes at least one vibrator, and a plurality of the vibrator groups are arranged on the vibrating plate body, and are arranged to surround a preset cleaning position in the cleaning tank, wherein the semiconductor When the cleaning device cleans the wafer, the wafer is in the preset cleaning position. The above technical solution can solve the problem that the current semiconductor cleaning equipment has poor cleaning effect on the wafer.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a semiconductor cleaning device and a wafer cleaning method. Background technique [0002] In the process of wafer processing, cleaning the wafer is an important step. At present, common semiconductor equipment uses mechanical brushing to clean the wafer, but the cleaning effect of this cleaning equipment is poor. SUMMARY OF THE INVENTION [0003] The invention discloses a semiconductor cleaning device and a wafer cleaning method, so as to solve the problem that the current semiconductor cleaning device has poor cleaning effect on the wafer. [0004] In order to solve the above problems, the present invention adopts the following technical solutions: [0005] In a first aspect, an embodiment of the present invention discloses a semiconductor cleaning device, comprising a cleaning tank and a transducer vibration plate disposed in the cleaning tank, the transduc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/12B08B13/00H01L21/67
CPCB08B3/12B08B13/00H01L21/67023
Inventor 王琳张明
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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