Circuit board blind hole processing method and related device
A processing device and circuit board technology, which is applied to printed circuits, printed circuit manufacturing, and secondary processing of printed circuits, can solve problems such as difficulty in controlling the depth of blind holes, increased processing equipment costs, and need to improve accuracy, so as to save adjustments Time spent on circuit boards, labor saving, and flexibility improvement effects
Inactive Publication Date: 2021-06-18
SHENZHEN TONGCHUANGXIN ELECTRONICS
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Problems solved by technology
[0004] The purpose of the present invention is to provide a method for processing blind holes in circuit boards and related devices, to solve the problem that the existing process of processing blind holes in circuit boards is generally to drill the holes in the circuit layer of Unicom in advance when individual circuits are connected, and finally glue them together. Generally speaking, this processing method requires more precise positioning and alignment devices, which increases the cost of processing equipment and increases the difficulty of processing, and is not widely cited. Moreover, some processing equipment that directly punches holes is difficult to control the depth of blind holes. Questions that need to be improved
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[0029] In order to make the technical means, creative features, goals and effects achieved by the present invention easy to understand, the present invention will be further described below in conjunction with specific embodiments.
[0030] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "another end" The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific Azimuth configuration and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood ...
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The invention discloses a circuit board blind hole processing method and a related device, and relates to the technical field of circuit board blind hole processing. The device comprises a main body mechanism, a mounting mechanism, a positioning device, a punching device and an adjusting device, the main body mechanism comprises a case, the mounting mechanism comprises a workbench and a frame, the lower surface of the frame is connected with the upper surface of the workbench, the lower surface of the workbench is connected with the upper surface of the case, and the positioning device comprises a connecting part and a sliding block; and the punching device comprises a transmission line and a processing module, one end of the transmission line is connected with the outer surface of the processing module, the other end of the transmission line is connected with the lower surface of the frame, the upper surface of the processing module is welded to the lower surface of the sliding block, and the adjusting device comprises a base with the lower surface connected with the upper surface of the workbench. The transmission line is used for absorbing energy in the equipment box and transmitting the energy to the processing module, after the processing module processes the energy, a circuit board is punched through laser emitted by the laser emitter, and a laser lamp is used for removing resin in a blind hole through laser.
Description
technical field [0001] The invention belongs to the technical field of circuit board blind hole processing, and in particular relates to a circuit board blind hole processing method and a related device. Background technique [0002] The blind hole of the circuit board means that the outermost circuit in the printed circuit board and the adjacent inner layer are connected by plated holes. Since the opposite side cannot be seen, it is called a blind hole. In order to increase the gap between the board circuit layers Space utilization, the blind hole comes in handy. The blind hole is a via hole to the surface of the printed board. The blind hole is located on the top and bottom surfaces of the circuit board and has a certain depth. It is used for the surface layer and the bottom layer. For the connection of layer circuits, the depth of the hole generally has a specified aperture. [0003] The existing circuit board blind hole processing process is generally to drill the Unico...
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IPC IPC(8): H05K3/00H05K3/26
CPCH05K3/0026H05K3/26H05K2203/0221
Inventor 席海龙毛雪雯
Owner SHENZHEN TONGCHUANGXIN ELECTRONICS