IC chip loading and sorting machine

Abstract

The invention discloses an IC chip loading and sorting machine. The IC chip loading and sorting machine comprises a transfer device, a first transferring device, a sorting and material moving device, a second transferring device and a classified storage device. The transfer device comprises a lifting frame and a transfer platform which is mounted on the lifting frame and can move up and down; the first transferring device is in butt joint with the transfer device; the sorting and material moving device is in butt joint with the first transferring device and the second transferring device; the sorting and material moving device comprises a first mechanical arm, a second mechanical arm and a sorting disc; the sorting disc can do reciprocating motion between the sorting and material moving device and the classified storage device; and the classified storage device is in butt joint with the sorting and material moving device and comprises multiple tray storage areas and a sorting mechanical arm. By means of the IC chip loading and sorting machine, discharging, sorting and loading work of tested IC chips can be automatically achieved in the whole process, meanwhile, automatic feeding and loading work of chips to be tested can be automatically achieved in the whole process, the automation degree is high, the working efficiency is effectively improved, and the labor cost is saved.

Description

technical field [0001] The invention relates to the technical field of IC chip sorting equipment, in particular to an automatic IC chip loading and sorting machine. Background technique [0002] IC chips, that is, large-scale integrated circuits, are used in various circuit structures to simplify the circuit scale. As a precision electronic device, after the chip is processed, it is first placed in a burn-in substrate (also called an aging test board) for testing. After the test is completed, the NG chips (unqualified chips) in the burn-in substrate need to be picked out. And store them in different levels, and then put other chips that passed the test into the material tray for storage. It can be seen that after the chip test is completed, the final sorting and loading of the chips will be completed after the chip test is completed. The process is cumbersome and error-prone. At present, although there are some equipment that can automatically sort and load chips, they gene...

AI Technical Summary

Problems solved by technology

As a precision electronic device, after the chip is processed, it is first placed in a burn-in substrate (also called an aging test board) for testing. After the test is completed, the NG chips (unqualified chips) in the burn-in substrate need to be picked out. And store them in different levels, and then put other chips that passed the test into the material tray for storage. It can be seen that after the chip test is completed, the final sorting and loading of the chips will be completed after the chip test is completed. The process is cumbersome and error-prone. At present, although there are some equipment that can automatically sort and load chips, they generally use different equipment to complete this series of work, which requires manual transfer of materials. , resulting in low work efficiency and high labor costs

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