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Preparation process of millimeter wave antenna-radio frequency integrated module

A millimeter-wave antenna and radio frequency integration technology, which is applied in the direction of printed circuit manufacturing, electrical components assembly printed circuits, electrical components, etc., to achieve the effect of improving efficiency, improving production efficiency, and shortening the number of processes

Pending Publication Date: 2021-06-25
KUNSHAN LIANTAO ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to meet the high-speed transmission requirements under 5G communication and the light and thin structural design of mobile phones, the company has developed a millimeter-wave antenna and integrated it with a radio frequency module to form an integrated circuit with an antenna circuit module and a radio frequency circuit module. , and has a microphone module, wherein, in the preparation process of the integrated circuit board, it is necessary to integrate a set number of electronic components on the circuit board to form a corresponding circuit module with a set function, wherein, for the microphone Modules need to be tested for sensitivity. In the prior art, there is no ready-made preparation process to obtain integrated circuit boards with the above functions

Method used

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  • Preparation process of millimeter wave antenna-radio frequency integrated module
  • Preparation process of millimeter wave antenna-radio frequency integrated module
  • Preparation process of millimeter wave antenna-radio frequency integrated module

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Embodiment 1

[0027] Please refer to figure 1 , this embodiment is a manufacturing process of a millimeter wave antenna and radio frequency integrated module, which includes the following steps:

[0028] S1) Prepare the substrate, and cut it into a monolithic structure according to the set contour shape;

[0029] S2) Mount the corresponding electronic components on the substrate according to the set procedure by using the SMT mounting process, and integrate the antenna module, radio frequency module and microphone unit on the substrate;

[0030] S3) A first carrier is provided, the first carrier is provided with a number of material-carrying holes that are arranged and distributed and conform to the outline of the substrate, and the substrate is placed on the first carrier in the form of one hole superior;

[0031] S4) Feed the first carrier boards in a stacked state, and then output the stacked trays one by one through the feeding mechanism, and transport them to the sensitivity testing ...

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Abstract

The invention discloses a preparation process of a millimeter wave antenna-radio frequency integrated module. The preparation process comprises the following steps: preparation of a substrate; mounting of electronic components; loading and testing; retesting; pasting of a film; disc rotating; bending; testing of electrical properties; appearance detection; discarding of scrapped products; and packaging and delivering. According to the invention, assembly line type automatic production can be realized, production efficiency is improved, invalid procedures are reduced, and each functional module can be prevented from being damaged.

Description

【Technical field】 [0001] The invention belongs to the technical field of antenna and radio frequency integrated circuit board production, and in particular relates to a preparation process of a millimeter wave antenna and radio frequency integrated module. 【Background technique】 [0002] With the development of communication technology, mobile terminal mobile phones are becoming thinner and lighter, and with the popularization of 5G communication, the requirements for antennas of mobile phones are also getting higher and higher. In order to meet the high-speed transmission requirements under 5G communication and the light and thin structural design of mobile phones, the company has developed a millimeter-wave antenna and integrated it with a radio frequency module to form an integrated circuit with an antenna circuit module and a radio frequency circuit module. , and has a microphone module, wherein, in the preparation process of the integrated circuit board, it is necessary...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K3/32
CPCH05K3/30H05K3/303H05K3/32
Inventor 程浪蔡泽高王虹淇陆伟许刚
Owner KUNSHAN LIANTAO ELECTRONICS CO LTD
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