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Cleaning device for improving silicon wafer surface cleaning capacity and control method thereof

A silicon wafer surface and control method technology, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve problems such as scratches on the surface of silicon wafers, achieve high operating stability, and solve mechanical A wound, the effect that the structure is simple

Pending Publication Date: 2021-07-02
杭州中欣晶圆半导体股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solved the problem of mechanical scratches on the surface of silicon wafers

Method used

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  • Cleaning device for improving silicon wafer surface cleaning capacity and control method thereof
  • Cleaning device for improving silicon wafer surface cleaning capacity and control method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0026] Example: such as figure 1 and figure 2 As shown, a cleaning device for improving the cleaning ability of the surface of a silicon wafer includes a cleaning tank 1, an upper frame 2 is arranged above the cleaning tank 1, a cleaning component 6 is arranged in the cleaning tank 1, and the lower end of the cleaning component 6 is connected to the cleaning tank 1. There is a rotating shaft 9 which is movable and nestedly connected with the cleaning tank 1, and a bearing 8 is arranged between the rotating shaft 9 and the cleaning tank 1. A tray 7 is provided between the rotating shaft 9 and the cleaning assembly 6 . A lift cylinder 4 is provided between the cleaning assembly 6 and the upper frame 2, and a connecting flange 5 is provided between the lift cylinder 4 and the cleaning assembly 6. A rotary motor 3 is arranged between the lifting cylinder 4 and the upper frame 2 . Cleaning assembly 6 comprises sheet box 10, and sheet box 10 is provided with 10 silicon wafers 12...

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Abstract

The invention relates to a cleaning device for improving silicon wafer surface cleaning capacity and a control method thereof, and belongs to the technical field of silicon wafer cleaning equipment. The cleaning device comprises a cleaning tank, an upper rack is arranged above the cleaning tank, a cleaning assembly is arranged in the cleaning tank, a lifting air cylinder is arranged between the cleaning assembly and the upper rack, and a rotating motor is arranged between the lifting air cylinder and the upper rack; the cleaning assembly comprises a wafer box, a plurality of silicon wafers distributed at equal intervals are arranged in the wafer box, upper baffles integrated with the wafer box are arranged at the two ends of the upper portion of each silicon wafer, and lower baffles integrated with the wafer box are arranged at the two ends of the lower portion of each silicon wafer. The cleaning device has the characteristics of simple structure, good cleaning effect, high operation stability and long service life; the problem that the surfaces of the silicon wafers are mechanically scratched is solved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cleaning equipment, in particular to a cleaning device and a control method for improving the surface cleaning ability of silicon wafers. Background technique [0002] During the manufacturing process of conductive silicon wafers, in order to avoid metal ions, atoms, organic matter and particles remaining on the surface of silicon wafers before the process, multiple surface cleaning steps are required to remove the pollutants attached to the surface. At present, the silicon wafer cleaning technology is wet chemical cleaning. Generally, the surface of the silicon wafer is cleaned with an acid-base solution, then overflowed with pure water, and finally dried with a spin dryer. [0003] The silicon wafer production process needs to go through multiple processes, and the differences in the processes and production machines of each process make the orientation of the silicon wafers placed in the ...

Claims

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Application Information

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IPC IPC(8): B08B3/10B08B13/00
CPCB08B3/10B08B13/00Y02P70/50
Inventor 戚定定
Owner 杭州中欣晶圆半导体股份有限公司
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