Cleaning device for improving silicon wafer surface cleaning capacity and control method thereof

A silicon wafer surface and control method technology, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve problems such as scratches on the surface of silicon wafers, achieve high operating stability, and solve mechanical A wound, the effect that the structure is simple

Pending Publication Date: 2021-07-02
杭州中欣晶圆半导体股份有限公司
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solved the problem of mechanical scra

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cleaning device for improving silicon wafer surface cleaning capacity and control method thereof
  • Cleaning device for improving silicon wafer surface cleaning capacity and control method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example: as figure 1 and figure 2 As shown, a cleaning device for improving the cleaning ability of the surface of silicon wafers includes a cleaning tank 1, an upper frame 2 is arranged above the cleaning tank 1, a cleaning component 6 is arranged in the cleaning tank 1, and the lower end of the cleaning component 6 is connected to the cleaning tank 1. There is a rotating shaft 9 which is movably nested and connected with the cleaning tank 1 , and a bearing 8 is arranged between the rotating shaft 9 and the cleaning tank 1 . A tray 7 is provided between the rotating shaft 9 and the cleaning assembly 6 . A lifting cylinder 4 is arranged between the cleaning component 6 and the upper frame 2 , and a connecting flange 5 is arranged between the lifting cylinder 4 and the cleaning component 6 . A rotary motor 3 is arranged between the lifting cylinder 4 and the upper frame 2 . The cleaning assembly 6 includes a wafer box 10 . The wafer box 10 is provided with 10 silicon...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to a cleaning device for improving silicon wafer surface cleaning capacity and a control method thereof, and belongs to the technical field of silicon wafer cleaning equipment. The cleaning device comprises a cleaning tank, an upper rack is arranged above the cleaning tank, a cleaning assembly is arranged in the cleaning tank, a lifting air cylinder is arranged between the cleaning assembly and the upper rack, and a rotating motor is arranged between the lifting air cylinder and the upper rack; the cleaning assembly comprises a wafer box, a plurality of silicon wafers distributed at equal intervals are arranged in the wafer box, upper baffles integrated with the wafer box are arranged at the two ends of the upper portion of each silicon wafer, and lower baffles integrated with the wafer box are arranged at the two ends of the lower portion of each silicon wafer. The cleaning device has the characteristics of simple structure, good cleaning effect, high operation stability and long service life; the problem that the surfaces of the silicon wafers are mechanically scratched is solved.

Description

technical field [0001] The invention relates to the technical field of silicon wafer cleaning equipment, in particular to a cleaning device and a control method for improving the surface cleaning ability of silicon wafers. Background technique [0002] During the manufacturing process of conductive silicon wafers, in order to avoid metal ions, atoms, organic matter and particles remaining on the surface of silicon wafers before the process, multiple surface cleaning steps are required to remove the pollutants attached to the surface. At present, the silicon wafer cleaning technology is wet chemical cleaning. Generally, the surface of the silicon wafer is cleaned with an acid-base solution, then overflowed with pure water, and finally dried with a spin dryer. [0003] The silicon wafer production process needs to go through multiple processes, and the differences in the processes and production machines of each process make the orientation of the silicon wafers placed in the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B08B3/10B08B13/00
CPCB08B3/10B08B13/00Y02P70/50
Inventor 戚定定
Owner 杭州中欣晶圆半导体股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap