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Method for solving solder mask ink film marks

A technology of solder resist ink and film, which is applied in printed circuits, printed circuit manufacturing, reinforcement of conductive patterns, etc., can solve the problems of affecting the appearance, worsening ink gloss, and unclean development, so as to avoid unclean development and avoid Wipe the flower, reduce the effect of operation and handling

Inactive Publication Date: 2021-07-09
AOSHIKANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the process of circuit board production, the board needs to be exposed. In order to avoid the problem of poor exposure during solder mask exposure, it is necessary to ensure that the film and the board are tightly bonded. During the exposure process, the air in the board and the film is removed by vacuuming, so that the board and the table Clinging to each other and extruding, a "film print" will be formed on the surface of the ink (mainly when the first side is exposed to the side that is close to the table), the gloss of the ink will deteriorate, and the appearance will be affected
In order to solve the problem of film printing, the current conventional method is generally to add baking for 3-15 minutes. This action is easy to cause excessive pre-baking and cause the problem of dirty development, and adding baking at the same time increases the operation process

Method used

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  • Method for solving solder mask ink film marks
  • Method for solving solder mask ink film marks
  • Method for solving solder mask ink film marks

Examples

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no. 1 example

[0032] Please refer to figure 1 , in the first embodiment of the present invention, the method that solves solder resist ink film printing comprises the following steps:

[0033] S1: Making a special backing plate b for exposure;

[0034] S2: During the alignment process, the special exposure backing plate b is placed between the exposure table a and the production plate c;

[0035] S3: Vacuumize and remove the air in the production board c and the film d, so that the production board c and the exposure table a are tightly pressed against each other.

[0036] The size of the special backing plate b for exposure is more than 10mm larger than a single side of the plate to be exposed.

[0037] Making the special backing plate b for exposure in the step S1 specifically includes the following steps:

[0038] L1: cutting: the size of the special exposure backing plate b needs to be larger than the size of the production plate c, and the thickness of the special exposure backing p...

no. 2 example

[0050] Based on the method for solving the solder resist ink film printing provided in the first embodiment of the present application, the second embodiment of the present application proposes another method for solving the solder resist ink film printing. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0051] The second embodiment of the present invention will be further described below in conjunction with the drawings and implementation methods.

[0052] Please refer to Figure 2-Figure 3 The difference between this embodiment and the first embodiment is that the exposure platform a includes a base 1, the top side of the base 1 is fixedly mounted with a placing table 2, and both sides of the base 1 are provided with a plurality of pressing A device 3, the pressing device 3 is used for pressing the production plate c.

[0053] Th...

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Abstract

The invention provides a method for solving solder mask ink film marks. The method comprises the following steps: S1, manufacturing a special exposure base plate b; S2, in the alignment process, placing the special exposure base plate b between an exposure table a and a production plate c; S3, performing vacuumizing to remove air in the production board c and the film d, so that the production board c and the exposure table board a are tightly attached and extruded with each other. The method for solving the solder mask ink film marks has the advantages of being convenient to use, high in space utilization efficiency and convenient to clean dust.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for solving solder resist ink film printing. Background technique [0002] In the process of circuit board production, the board needs to be exposed. In order to avoid the problem of poor exposure during solder mask exposure, it is necessary to ensure that the film and the board are tightly bonded. During the exposure process, the air in the board and the film is removed by vacuuming, so that the board and the table Close to each other and squeeze, a "film print" will be formed on the surface of the ink (mainly when the first side is exposed to the side that is close to the table), the gloss of the ink will deteriorate, and the appearance will be affected. In order to solve the problem of film printing, the current conventional method is generally to add baking for 3-15 minutes. This action is likely to cause excessive pre-baking and cause the problem of...

Claims

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Application Information

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IPC IPC(8): H05K3/24
CPCH05K3/247H05K3/246H05K2203/013
Inventor 姚清姚斌吴玉海
Owner AOSHIKANG TECH CO LTD