Sensor assembly

A technology of sensor components and sensing units, which is applied in the detection field, can solve problems such as unfavorable sensor component stability and easy shaking of lead wires, and achieve effects that are conducive to stability and reduce the risk of shaking

Pending Publication Date: 2021-07-13
HANGZHOU SANHUA RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the related art, there is a risk that the lead wires (28b, 28c) are easy to shake, which is not conducive to the stability of the sensor assembly

Method used

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Embodiment Construction

[0039] The exemplary embodiment will be described in detail herein, and examples thereof are shown in the drawings. The following description is related to the drawings, unless otherwise indicated, the same numbers in the drawings represent the same or similar elements. The embodiments described in the exemplary embodiments are not meant to all embodiments consistent with the present application. In contrast, examples of apparatus and methods consistent with some aspects of the present application are intended in detailed in the appended claims.

[0040] It should be understood that the specification of the present application and the claims, such as "first", "second", and similar words do not represent any order, quantity or importance, but only naming distinguishing characteristics. . Similarly, "one" or "one" or the like does not represent the quantity limit, but is at least one. Unless otherwise indicated, "front", "post", "left", "right", "upper", "lower", etc., "", ",", "low...

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Abstract

A sensor assembly provided by the invention comprises a pressure sensing unit, a temperature sensing unit, a base, a circuit board unit and a shell, the pressure sensing unit is electrically connected with the circuit board unit, the base is fixed to the shell, the temperature sensing unit comprises a temperature sensing part and a conductive part, and the temperature sensing part is electrically connected with the circuit board unit. The temperature sensing part and the circuit board unit are located on the two opposite sides of the thickness direction of the base, and the conductive part is electrically connected with the temperature sensing part and the circuit board unit. The conductive part comprises a first part and a second part, the first part is electrically connected with the temperature sensing part and the second part, the second part is electrically connected with the first part and the circuit board unit, at least one part of the second part is fixed in the pressure sensing unit, and at least one part of the first part is fixed in the base. The sensor assembly is good in stability.

Description

Technical field [0001] The present application relates to the field of detection, and in particular, there is a sensor assembly. Background technique [0002] Such as Figure 19 with Figure 20 As shown in the related art, the sensor assembly 10 includes a variable capacitor 14 and a temperature sensor 28. The variable capacitor 14 has a rigid substrate 14a and a flexible diaphragm 14b, and the flexible diaphragm 14b is exposed to fluid pressure chamber 12K for sensing pressure. The temperature response element 28a is mounted on the surface of the flexible diaphragm 14b exposed to the fluid pressure chamber 12K, the electrical signal of the temperature responsive element 28a passes through the lead wires 28b, 28c, passes through the conductive pin 26d, 26e of the variable capacitor 14, and passes to the circuit chamber. 20C. The lead (28b, 28c) is electrically connected to the conductive epoxy resin with the conductive epoxy resin. In the relevant technique, leads (28b, 28c) have a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01D21/02
CPCG01D21/02
Inventor 郭雨辰万霞饶欢欢
Owner HANGZHOU SANHUA RES INST CO LTD
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