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Component mounting device

A technology for installing devices and components, applied in the direction of electrical components, electrical components, etc., can solve the problem of position deviation without any consideration and cannot be fully dealt with

Active Publication Date: 2021-07-23
FUJI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, although the component mounting device described in Patent Document 1 can correct the mounting height, it does not take any consideration of the position deviation in the horizontal direction caused by the inclination of the substrate surface
In addition, the component mounting apparatus described in Patent Document 2 estimates the warpage of the substrate by using an angle sensor (non-contact optical sensor) provided on the back surface of the substrate. Can't adequately cope with the tilted way

Method used

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Embodiment Construction

[0028] Next, reference will be described with reference to the drawings and described in the following manner.

[0029] figure 1 It is a schematic configuration diagram showing the configuration of the element mounting device 10 of the present embodiment. figure 2 It is a schematic configuration diagram showing the structure of the head portion 40. image 3 It is an explanatory diagram showing an electrical connection relationship of the control device 50. It should be noted, figure 1 The left and right directions are the X-axis direction, and the front (front side) direction is the Y-axis direction, and the upper and lower direction is the Z-axis direction.

[0030] like figure 1 As shown, the element mounting device 10 includes a component supply device 21, a substrate conveying device 22, an XY moving device 30, a head 40, a component camera 26, a label camera 27, a laser sensor 28, and a control device 50 (see image 3 ).

[0031] The element supply device 21 supplies the eleme...

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PUM

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Abstract

This component mounting device is provided with a substrate height sensor which is provided so as to be horizontally movable by a horizontal movement device and which measures the height of a substrate surface. The component mounting device causes the substrate height sensor to horizontally move to a plurality of measurement points and causes the sensor to measure the height of the substrate surface at each of the plurality of measurement points. Subsequently, the component mounting device calculates horizontal positional displacement of a target mounting position on the substrate surface on the basis of the measured height of the substrate surface. Furthermore, the component mounting device calculates vertical positional displacement of the target mounting position on the basis of the measured height, in the vertical direction, of the substrate surface. In addition, the component mounting device revises the target mounting position on the basis of the calculated horizontal positional displacement and vertical positional displacement, and mounts a component to the revised position.

Description

Technical field [0001] This specification discloses an element mounting device. Background technique [0002] Conventionally, a component mounting device is proposed to adsorb the electronic component supplied from the element supply device to the substrate surface (see, for example, Patent Document 1). The component mounting device includes a laser sensor at the head, using a laser sensor to determine the surface height of the substrate. Further, the element mounting device corrects the value of the mounting height based on the surface height of the measured substrate, and mounts the element on the surface of the substrate based on the corrected mount height. [0003] Further, a component mounting device, a warp height of the measurement substrate, calculates the positional deviation amount on the XY direction (horizontal direction) of the mounting position, based on the measured warpage height, based on the calculated positional deviation amount To modify the amount of movement...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
CPCH05K13/0815H05K13/0812H05K13/082H05K13/0413
Inventor 大月孝浩清水利律
Owner FUJI KK