Mask plate and use method of mask plate
A mask and exposure area technology, applied in the field of masks, can solve the problems of low utilization efficiency of masks, high R&D and production costs, and a large number of masks used, so as to reduce R&D and production costs, improve utilization efficiency, reduce Effect of using quantity
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Embodiment 1
[0039] see figure 1 , figure 1 A top view of the mask 10 provided in this embodiment of the application, the mask 10 includes a first exposure area 100 and a second exposure area 200, the second exposure area 200 is located on any side of the first exposure area 100; the first exposure area 100 is set There is a first preset pattern for forming the first functional film layer, and the second exposure area 200 is provided with a second preset pattern for forming the second functional film layer, wherein the first exposure area 100 and the second exposure area 200 are in the same position. Work at different times.
[0040] In some embodiments, see figure 2 , the first exposure area 100 is used before the second exposure area 200 , and the first functional film layer 31 and the second functional film layer 32 are located in different film layers.
[0041] Specifically, as figure 2 As shown, after the first functional film layer 31 is formed on the substrate 30 by the first ...
Embodiment 2
[0050] see Figure 4 , 5 , Figure 4 , 5 The top views of the other two mask sheets 10 provided in the embodiments of the present application are respectively, the mask sheet 10 further includes a third exposure area 300, and the first exposure area 100, the second exposure area 200 and the third exposure area 300 are all in different time periods use.
[0051] Specifically, the first exposure area 100 is provided with a first preset pattern for forming the first functional film layer, the second exposure area 200 is provided with a second preset pattern for forming the second functional film layer, and the third exposure area 300 A third preset pattern for forming the third functional film layer is provided, wherein the first exposure area 100 , the second exposure area 200 and the third exposure area 300 are all used in different time periods.
[0052] In some embodiments, see Figure 4 , the first exposure area 100 , the second exposure area 200 and the third exposure ...
Embodiment 3
[0061] see Image 6 , the embodiment of the present application also provides a method for using any of the above-mentioned masks, and the method for using the mask includes the following steps:
[0062] Step S100 : providing a substrate, forming a first film layer on the substrate, forming a first photoresist on the first film layer, exposing the first photoresist using the first preset pattern of the first exposure area, and then performing The developing and etching processes form the first functional film layer, and the second exposure area is in a shielded state at this time;
[0063] Step S200 : forming a second film layer on the first functional film layer, forming a second photoresist on the second film layer, exposing the second photoresist using the second preset pattern of the second exposure area, and then performing The developing and etching processes form the second functional film layer, and the first exposure area is in a shielding state at this time.
[006...
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