PCB and blade coating process thereof

Abstract

The invention discloses a PCB and a blade coating process thereof, and relates to the technical field of PCB blade coating, in particular to a protective shell and a circuit board, an upper groove position is formed in the upper surface of the protective shell, a lower groove position is formed in the lower surface of the protective shell, limiting columns are fixed to the four corners of the bottom surface of the upper groove position, clamping grooves are formed in the left side and the right side of the protective shell, a transfer groove is formed in the outer wall of the front end of the protective shell, a through opening is formed in the middle of the bottom face of the upper groove position, the circuit board is arranged in the upper groove position, hole positions are formed in the four corners of the upper surface of the circuit board, and fixing blocks are arranged on the left side and the right side of the conveying belt. According to the PCB and the blade coating process thereof, the air pump arranged in the bearing plate can jack up the circuit board in the protective shell and tightly attach the circuit board to the lower surface of the printing steel mesh for blade coating treatment, so that the blade coating effect is guaranteed, the air pump can enable the circuit board attached to the lower surface of the printing steel mesh to be separated through suction, and the problem that the printed material adheres to the printing steel mesh and is difficult to discharge is avoided.

Description

technical field [0001] The invention relates to the technical field of PCB board scraping coating, in particular to a PCB board and a scraping coating process thereof. Background technique [0002] Before the circuit board is chip-mounted, it is necessary to scrape the solder paste on its surface. Usually, the circuit board is manually placed on the surface of the hanging device for scraping treatment. The process needs to continuously add solder paste to the surface of the printing stencil. , to meet the normal scraping of the product. [0003] At present, the process of scraping solder paste on circuit boards on the market is usually manual loading and unloading, and the process automation is low, and the circuit board after scraping is easy to adhere to the lower surface of the printing stencil, which makes the handling process very troublesome. For the above situation, we introduced a PCB board and its scraping process. Contents of the invention [0004] Aiming at th...

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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a PCB board and its scraping process, which solves the problem mentioned in the above-mentioned background technology that the solder paste scraping process for circuit boards on the market is usually manual loading and unloading, and the process automation is relatively low. , and the circuit board after scraping is easy to adhere to the lower surface of the printing stencil, which leads to a very troublesome problem in the process of taking it

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