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Integrated electronic component surface mounting device

A surface mount and integrated electronics technology, which is applied in the direction of assembling printed circuits, electrical components, electrical components, etc. with electrical components, can solve problems such as inaccuracy, loose components and calibration, and achieve the effect of accurate placement

Inactive Publication Date: 2021-08-03
广州皓景数码科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a surface mount equipment for integrated electronic components, which solves the problems of loose components and inaccurate calibration during the mounting process

Method used

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  • Integrated electronic component surface mounting device
  • Integrated electronic component surface mounting device
  • Integrated electronic component surface mounting device

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Embodiment Construction

[0023] Combine below Figure 1-7 The present invention is described in detail, wherein, for the convenience of description, the orientations mentioned below are defined as follows: figure 1 The up, down, left, right, front and back directions of the projection relationship itself are the same.

[0024] combined with Figure 1-7 The surface mount equipment for integrated electronic components includes a device body 10, the device body 10 includes a mounting needle 11 and a fixed clamping groove 12 fixedly connected to the lower end of the mounting needle 11, the The placement needle 11 is provided with two left and right symmetrical clamping transmission chambers 13, and a telescopic suction rod 14 arranged in the placement needle 11 is arranged between the two clamping transmission chambers 13. A suction pipe 15 is provided in the suction rod 14, and the lower end of the telescopic suction rod 14 is connected with a component sucker 16 which is connected to the suction pipe ...

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Abstract

The present invention discloses an integrated electronic component surface mounting device which comprises a device main body, the device main body comprises a mounting needle head and a fixed clamping groove fixedly connected to the lower end of the mounting needle head, and the mounting needle head is internally provided with two clamping transmission cavities in bilateral symmetry. A telescopic suction rod arranged in the mounting needle head is arranged between the two clamping transmission cavities, and an air suction pipe is arranged in the telescopic suction rod; according to the integrated electronic component surface mounting equipment, a mounting grabbing needle head for grabbing a component is improved, the component is sucked by a suction cup and clamped left and right at the same time when the component is grabbed, the component is prevented from loosening and falling off in the mounting moving process, and meanwhile, a structure for detecting the levelness of the component is arranged in the grabbing needle head, the component is detected before mounting, and when the component is detected to have an inclination angle, the component can be adjusted to a horizontal state in time, so that mounting is more accurate.

Description

technical field [0001] The invention relates to the technical field of electrical component processing equipment, in particular to surface mounting equipment for integrated electronic components. Background technique [0002] SMT is the abbreviation of surface mount technology. It is the most popular technology and process in the electronic assembly industry. SMT is characterized by high assembly density, small size and light weight of electronic products. With the diversification of electronic product functions, products There are more and more devices, and the integration is getting higher and higher. For the traditional manufacturing industry, the disappearance of the domestic demographic dividend has made the labor cost higher and higher. The manual manufacturing industry has become an urgent need for transformation. The existing surface mount Due to the installation equipment and process, it is difficult to tightly attract the components when grabbing the device, which ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K13/08H05K3/32
CPCH05K3/32H05K13/0408H05K13/046H05K13/0409H05K13/082
Inventor 王翠侠
Owner 广州皓景数码科技有限公司
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