A dynamic bond cross-linked highly filled thermally conductive composite material and its preparation method and application

Abstract

The invention provides a dynamic bond cross-linked high-filling heat-conducting composite material and a preparation method and application thereof. The dynamic bond cross-linked highly filled thermally conductive composite material of the present invention is prepared from the following components by weight: 100 parts of a polymer matrix; 12 to 150 parts of modified inorganic thermally conductive fillers; Linear oligomers and branched oligomers of reversible DA bonds; the modified inorganic thermally conductive filler contains functional groups that can react with reversible DA bonds; the weight ratio of the linear oligomers and branched oligomers is 2 ~10:1. The composite material of the invention can still maintain good processing performance and mechanical performance under the condition of high filling amount, and meanwhile has excellent self-repair effect and repeated recycling ability.

Description

technical field [0001] The invention belongs to the technical field of polymer composite materials, and in particular relates to a dynamic bond cross-linked high-filling heat-conducting composite material and its preparation method and application. Background technique [0002] With the rapid development of the modern electronic communication industry, especially after entering the 5G era, the electronic industry has higher and higher heat dissipation requirements and mechanical performance requirements for electronic packaging materials. Inorganic particle-filled composite materials have the characteristics of electrical insulation, high thermal conductivity, and low thermal expansion coefficient, and are suitable for electronic packaging materials. [0003] Electronic packaging materials need better thermal conductivity, so more thermal conductive fillers need to be added. With the increase of filler, on the one hand, too much filler will easily cause difficulty in disper...

AI Technical Summary

Problems solved by technology

With the increase of filler, on the one hand, too much filler will easily cause difficulty in dispersion and agglomeration of the filler in the matrix, resulting in a decrease in the mechanical properties of the material; The processing method of molding, with the increase of the filler content, the viscosity of the processing system increases rapidly, and the processability and fluidity of the material will become worse and worse, making it difficult to realize the melt blending and blending of high-filling composite materials extrusion injection molding

[0004] Although in the prior art, polymers and fillers are modified using reversible DA bonds to improve the dispersion of fillers in polymer aggregates (such as Chinese patent CN109456425A), the mixing of the polymer matrix and fillers is in a solvent , which is not conducive to environmental protection; at the same time, the filling amount of the filler still needs to be improved

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