Wallboard laying and leveling method

A leveling and wall panel technology, applied in the direction of architecture, building structure, etc., can solve the problems of low wall installation efficiency, and achieve the effect of improving installation efficiency and installation accuracy, improving readjustment, and improving stability.

Inactive Publication Date: 2021-08-24
变形积木(北京)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the related technologies mentioned above, the inventor believes that there is a defect of low wall installation efficiency

Method used

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  • Wallboard laying and leveling method
  • Wallboard laying and leveling method

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Embodiment Construction

[0042] The following is attached Figure 1-4 The application is described in further detail.

[0043] The embodiment of the present application discloses a wallboard laying and leveling method, which includes the following steps:

[0044] S1. Reference figure 1 When the wall body 1 is being constructed, a number of pre-embedded blocks 2 are fixed in the wall body 1 in advance, and the pre-embedded blocks 2 are arranged towards the side opening of the front of the wall body 1 .

[0045] S2. Reference figure 1 and figure 2 , insert the leveling screw 5 horizontally into each pre-embedded block 2, and fix the leveling screw 5 and the pre-embedded block 2 through two sets of clamping components 3; the clamping component 3 includes a clamping spring 31 and a clamping block 32, The opposite side walls in the pre-embedded block 2 are horizontally provided with snap-in grooves 21, and both sides of the circumferential side walls of the leveling screw 5 are provided with snap-in s...

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Abstract

The invention relates to a wallboard laying and leveling method. The wallboard laying and leveling method comprises the following steps that S1, a plurality of pre-buried blocks are fixed in a wall body in advance during wall body construction, and the pre-buried blocks are arranged towards an opening in one side of the front face of the wall body; S2, leveling screw rods are horizontally inserted into the pre-buried blocks, and the leveling screw rods and the pre-buried blocks are fixed through clamping assemblies; S3, leveling screw pieces are connected to the leveling screw rods in a threaded mode, the side walls, deviating from the wall body, of all the leveling screw pieces are located on the same vertical plane, and then the leveling screw pieces and the leveling screw rods are fixed to each other through a positioning mechanism; S4, a wallboard is inserted into the leveling screw rods, and the back face of the wallboard is attached to the side walls, deviating from the wall body, of all the leveling screw pieces; S5, fixing nuts are screwed on the leveling screw rods, so that the wallboard is tightly jacked on the leveling screw pieces by the fixing nuts, and the fixing nuts are located in containing grooves formed in the front face of the wallboard; and S6, the leveling screw rods protruding out of the containing grooves are cut off. The wallboard laying and leveling method has the effect of improving the wall body installation efficiency.

Description

technical field [0001] The present application relates to the technical field of wallboard laying, in particular to a wallboard laying and leveling method. Background technique [0002] In the indoor and outdoor decoration process, it is necessary to lay wallboards on the existing walls to improve the aesthetics. [0003] However, the existing wall surface is uneven, and the staff often grinds the wall surface and then bonds the wallboard to the wall surface. [0004] With regard to the related technologies mentioned above, the inventor believes that there is a defect of low wall installation efficiency. Contents of the invention [0005] In order to reflect the high efficiency of wall installation, the application provides a method for laying and leveling wall panels. [0006] A wallboard laying and leveling method provided by the application adopts the following technical scheme: [0007] A wallboard laying and leveling method, comprising the following steps: [0008...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04F21/18
CPCE04F21/1877
Inventor 许振张轶然王子诚
Owner 变形积木(北京)科技有限公司
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