A z-theta combination device for wafer inspection
A combination device and wafer technology, applied in the direction of measuring devices, material inspection products, testing semiconductor materials, etc., can solve the problems of low positioning accuracy and complex structure, and achieve high positioning accuracy, improved accuracy, and compact structure.
Active Publication Date: 2021-11-12
武汉中导光电设备有限公司
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Problems solved by technology
[0004] The embodiment of the present application provides a Z-Theta combination device for wafer inspection to solve the problems of complex structure and low positioning accuracy of existing devices in the related art
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[0029] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments It is a part of the embodiments of this application, but not all of them. Based on the embodiments in the present application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present application.
[0030] The embodiment of the present application provides a Z-Theta combination device for wafer inspection, which can solve the problems of complex structure and low positioning accuracy of existing devices in the related art.
[0031] figure 1 It is the front view of the Z-Theta combination device used for wafer detection provided by...
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The present application relates to the technical field of wafer detection, in particular to a Z-Theta combination device for wafer detection. The Z-Theta combination device provided by this application includes: a base plate; a Z-axis module, including a Z-axis load plate and a wedge-shaped Z-axis slider, the Z-axis slider is placed on the base plate, and the Z-axis load plate is slidably arranged on the Z-axis slide on the top slope of the block; the first driving device is used to drive the Z-axis slider to move in the horizontal direction along the bottom plate, and the Z-axis slider moves horizontally to drive the Z-axis load plate to move in the vertical direction; the T-axis module includes The T-axis load plate arranged above the Z-axis load plate; the second driving device is used to drive the T-axis load plate to rotate; the suction cup is arranged above the T-axis load plate to place the wafer, and several small hole; ejector rod group, one end of which is connected to the base plate, and the other end passes through the Z-axis load plate and extends into the small hole of the suction cup, and the ejector rod group lifts the wafer after the position of the suction cup descends.
Description
technical field [0001] The present application relates to the technical field of wafer inspection, in particular to a Z-Theta combination device for wafer inspection. Background technique [0002] All kinds of electronic devices that are common in daily life, such as mobile phones, computers, TVs and air conditioners, all rely on the logic computing, storage and sensing capabilities provided by various chips. The core of each chip is a wafer, which is cut from wafers of various specifications. The wafer itself has yield problems, and there may be various defects on the surface of the wafer. In order to prevent defective chips from flowing into the subsequent packaging process, it is necessary to use testing equipment to identify, classify, and mark defects on the wafer surface to assist chip sorting. [0003] During wafer inspection, the Z-Theta device is usually used to adjust the position of the wafer for accurate positioning. The currently used device is a stack of a sep...
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IPC IPC(8): H01L21/67H01L21/68H01L21/66G01N33/00
CPCG01N33/00G01N2033/0095H01L21/67288H01L21/68H01L22/12H01L22/20
Inventor 郭建华
Owner 武汉中导光电设备有限公司