Unlock instant, AI-driven research and patent intelligence for your innovation.

A wafer cleaning system and cleaning method capable of keeping cleaning roller clean

A cleaning system and technology for cleaning rollers, applied in cleaning methods and utensils, cleaning methods using liquids, cleaning methods using tools, etc., can solve the problems of secondary pollution, affecting the cleaning effect of wafers, etc. The effect of maintaining performance

Active Publication Date: 2022-07-29
HWATSING TECH
View PDF18 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the roller brush with a large amount of particles attached is not handled regularly, these particles may affect the cleaning effect of subsequent wafers, and even cause secondary pollution problems

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A wafer cleaning system and cleaning method capable of keeping cleaning roller clean
  • A wafer cleaning system and cleaning method capable of keeping cleaning roller clean
  • A wafer cleaning system and cleaning method capable of keeping cleaning roller clean

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] The technical solutions of the present invention will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention, used to illustrate the concept of the present invention; these descriptions are all explanatory and exemplary, and should not be construed as limiting the embodiments of the present invention and the protection scope of the present invention . In addition to the embodiments described herein, those skilled in the art can also adopt other obvious technical solutions based on the content disclosed in the claims of the present application and the description thereof, and these technical solutions include adopting any modifications made to the embodiments described herein. Obvious alternative and modified technical solutions.

[0039] The accompanying drawings in this specification are schematic diagrams to help explain the concept of the presen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a wafer cleaning system and a cleaning method capable of keeping a cleaning roller clean. The wafer cleaning system comprises: a wafer support part, which supports the wafer horizontally and drives the wafer to rotate; a cleaning roller is arranged on the Both sides of the wafer and roll around its axis; a liquid supply pipe, which is arranged on the side of the wafer to spray cleaning liquid toward the surface of the wafer; a flushing pipe and its swing driving part, the flushing pipe is parallel to the cleaning roller It is arranged and located on both sides of the wafer, and the fluid sprayed by the nozzles configured on it rinses the surface of the wafer; the swing driving part is arranged at the end of the rinse pipe, and drives the rinse pipe to rotate, so that the nozzle faces the cleaning A fluid is sprayed from the outer peripheral side of the roller to wash off the particulate matter adhering to the cleaning roller.

Description

technical field [0001] The invention belongs to the technical field of wafer cleaning, and in particular relates to a wafer cleaning system and a cleaning method capable of keeping cleaning rollers clean. Background technique [0002] The integrated circuit industry is the core of the information technology industry and plays a key role in the process of boosting the transformation and upgrading of the manufacturing industry to digitalization and intelligence. Cleaning is one of the most important and frequent steps in the chip manufacturing process. The purpose of cleaning is to avoid the contamination of semiconductor devices by trace ions and metal particles, and to ensure the performance and qualification rate of semiconductor devices. Wafer cleaning methods include: roller brush cleaning, megasonic cleaning, etc. Among them, roller brush cleaning is widely used. [0003] In the roller brush cleaning, the wafer is arranged on the supporting rollers of the box body, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/02H01L21/67B08B1/02B08B3/02B08B3/12
CPCB08B1/02B08B1/007B08B1/002B08B3/022H01L21/67046H01L21/67051H01L21/02052
Inventor 马旭刘远航赵德文李长坤郑广建
Owner HWATSING TECH