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Heat dissipation device and case with same

A cooling device and chassis technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of taking up space on the motherboard and poor cooling effect

Pending Publication Date: 2021-09-10
HONG FU JIN PRECISION IND WUHAN CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the size of the chassis remains the same, as the number of hard disks increases, it will not only occupy a large amount of space on the motherboard, but also have a poor heat dissipation effect.

Method used

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  • Heat dissipation device and case with same
  • Heat dissipation device and case with same
  • Heat dissipation device and case with same

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Experimental program
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Embodiment Construction

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the implementation manners in the present invention, all other implementation manners obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention.

[0024] In the present invention, unless otherwise clearly specified and limited, if there is a term "connection", the term should be interpreted in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection ; It can be directly connected, or connected through an intermediary, or two components can be connected internally. Those of ordi...

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Abstract

A heat dissipation device is used for heat dissipation of at least one hard disk and comprises a base, a heat conduction pipe, a first heat dissipation part and an installation part, the middle end of the heat conduction pipe is connected with the base, and the two ends of the heat conduction pipe extend in the direction away from the base. The plurality of first heat dissipation parts are arranged in a stacked manner and are sequentially inserted into the two ends of the heat conduction pipe in a penetrating manner, the mounting parts are vertically mounted on the two sides of the first heat dissipation parts, and the hard disk is fixedly mounted on the mounting parts. The invention further discloses a case. According to the computer case, the hard disks are vertically arranged on the two sides of the first heat dissipation part, so that the heat dissipation effect of the hard disks is improved, and the space of the computer case is saved.

Description

technical field [0001] The invention relates to a heat dissipation device and a case with the heat dissipation device. Background technique [0002] With the development of science and technology, people's demand for mobile hard drives is increasing. However, under the condition that the size of the chassis remains the same, as the number of hard disks increases, it will not only occupy a large amount of space on the motherboard, but also have a poor heat dissipation effect. Contents of the invention [0003] In view of the above, it is necessary to provide a heat dissipation device with good heat dissipation effect and can effectively save the space of the case, and a case with the heat dissipation device. [0004] A heat dissipation device, used for heat dissipation of at least one hard disk, the heat dissipation device includes a base, a heat pipe, a first heat dissipation part and a mounting part, the middle end of the heat pipe is connected to the base, and the heat ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/20G06F1/182G06F1/183G06F1/187
Inventor 徐仲恺洪忠仁陈钦洲陈进铭
Owner HONG FU JIN PRECISION IND WUHAN CO LTD