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A method for observing the phase boundary of materials using phase-locked infrared imaging

An infrared imaging and phase-locking technology, which is applied in the direction of material thermal development, can solve problems such as size and surface restrictions, affecting quality and application, and achieve high detection accuracy

Active Publication Date: 2022-07-15
UNIV OF SCI & TECH OF CHINA
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] Defects and second phases in materials will seriously affect its quality and application. Traditional means of characterizing the distribution of defects and phase regions in materials include metallographic microscopy, transmission electron microscopy, X-ray diffraction, corrosion observation, infrared flaw detection, etc. Most of these methods rely on the absorption and reflection of photons, electrons, etc. or chemical reactivity of materials, and have strict restrictions on the size and surface of materials.

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  • A method for observing the phase boundary of materials using phase-locked infrared imaging
  • A method for observing the phase boundary of materials using phase-locked infrared imaging
  • A method for observing the phase boundary of materials using phase-locked infrared imaging

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[0014] The technical method of the present invention will be described below with reference to the accompanying drawings in the embodiments of the present invention.

[0015] figure 1 It is a schematic structural diagram of a phase-locked infrared phase boundary detection in an embodiment of the present invention. like figure 1 As shown, a phase-locked infrared thermal imaging device includes a sample excitation power supply (Keithley2400 square-wave current source mode output, frequency 1-25Hz), an infrared camera (exposure frequency 20-100Hz, which needs to be higher than the excitation frequency during measurement), a lock Phase analysis system, computer display and control system. like figure 1 Shown: the excitation power is connected to the sample and the reference signal input of the phase-locked system, the other input of the phase-locked system is connected to the output of the infrared camera, and the entire measurement system is connected to the computer for data ...

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Abstract

The invention discloses a method for observing the material phase boundary of a material by using phase-locked infrared imaging, comprising the following steps: first, positive and negative alternating driving currents are connected to both ends of the material with phase distribution, and due to the Peltier effect, the two ends of the phase boundary are connected. The side generates periodic heat absorption and exotherm of the same frequency as the driving current, generates periodic temperature modulation and infrared radiation, and then uses the phase-locked infrared nondestructive detection device to capture the infrared signal of the same frequency as the driving current to obtain the near-surface temperature of the sample caused by the pyroelectric effect. distribution to determine the location of the internal phase boundaries of the material.

Description

technical field [0001] The present invention relates to the field of thermoelectric effect and the field of non-destructive testing. Specifically, the method of using phase-locked infrared imaging to observe the material phase boundary, using the Peltier effect and the active phase-locked infrared nondestructive testing device. Background technique [0002] Defects and second phases in materials will seriously affect their quality and application. Traditional methods to characterize the internal defects and phase distribution of materials include metallographic microscopy, transmission electron microscopy, X-ray diffraction, corrosion observation, infrared flaw detection, etc. Most of these methods rely on the material's absorption and reflection of photons, electrons, etc., or chemical reactivity, and have strict constraints on the size and surface of the material. Among them, the traditional active phase-locked infrared flaw detection technology uses electric heating or l...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N25/20
CPCG01N25/20
Inventor 侯达之谭浦琨
Owner UNIV OF SCI & TECH OF CHINA