Circuit board with offset, and manufacturing method of circuit board
A manufacturing method and circuit board technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, structural connection of printed circuits, etc., can solve problems such as circuit board pollution, poor filling at gaps, and difficulty in controlling filling overflow
Active Publication Date: 2021-09-14
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0002] At present, the production of multilayer circuit boards mostly requires gaps. If the protective film is pasted in a conventional way, there will often be poor filling of the gaps. For example, air bubbles will bring Risks, especially the contamination of the circuit board by residual chemicals in the wet process and the bursting of the protective film during the thermal process
However, if a protective film containing thick glue is used, there is a problem that it is difficult to control the overflow of filling glue.
Method used
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[0057] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.
[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application.
[0059] Some implementations of the present application will be described in detail below in conjunction wit...
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Abstract
A manufacturing method of a circuit board comprises the following steps: providing a carrier plate, wherein the carrier plate comprises an insulating base layer, a first conducting layer and a second conducting layer, and the first conducting layer and the second conducting layer are arranged on the two back-to-back surfaces of the insulating base layer respectively; etching the first conductive layer to form a first conductive circuit layer; forming a first dielectric layer on the surface of the first conductive circuit layer; forming at least one second dielectric layer and a second conductive circuit layer on a part of the surface of the first dielectric layer, so as to form a first offset region between the second dielectric layer and the first dielectric layer; and forming a first covering film on the surface, back to the insulating base layer, of the second conductive circuit layer, wherein the first offset area is exposed out of the first covering film. The invention further provides a circuit board.
Description
technical field [0001] The present application relates to the field of circuit board manufacturing, in particular to a circuit board with gaps and a method for manufacturing the circuit board. Background technique [0002] At present, the production of multilayer circuit boards mostly requires gaps. If the protective film is pasted in a conventional way, there will often be poor filling of the gaps. For example, air bubbles will bring Risks, especially the contamination of the circuit board by residual chemicals in the wet process and the bursting of the protective film during the thermal process. However, if a protective film containing thick glue is used, there is a problem that the filling overflow glue is difficult to control. Contents of the invention [0003] In view of this, it is necessary to provide a method for manufacturing a circuit board to solve the above problems. [0004] The application also provides a circuit board. [0005] A method for manufacturing ...
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Login to View More IPC IPC(8): H05K3/46H05K3/22H05K1/14
CPCH05K3/4644H05K3/22H05K1/14
Inventor 李艳禄李洋刘立坤王超
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD