Thermal stress testing method for thermal vacuum test

Abstract

The invention provides a thermal stress testing method for a thermal vacuum test, which comprises the following steps: 1, pasting a strain gauge and a thermocouple at a measuring point position of a measured piece, wherein the strain gauge measures a strain value of the measuring point, and the thermocouple measures an instant temperature of the measuring point; 2, selecting a test piece made of the same material as the measured piece, pasting a strain gauge and a thermocouple on the test piece, measuring the strain value of the test piece by the strain gauge, and measuring the instant temperature of the test piece by the thermocouple; 3, placing the tested piece and the test piece in a vacuum tank, and enabling the temperature of the test piece to be consistent with the temperature of the tested piece; 4, connecting a strain gauge and a thermocouple cable, and collinearly connecting a measuring point lead of the measured piece and a measuring point lead of the test piece for compensation; 5, during the thermal vacuum test, observing the test temperature change condition, ensuring that the temperature of the test piece and the temperature of the tested piece are kept consistent, and recording strain values and corresponding temperature values of all working conditions in real time; and 6, according to the strain test data, calculating thermal stress data of the test point of the tested piece under different temperature conditions.

Description

Technical field [0001] The present invention relates to the field of satellite structural stress testing, and more particularly to a thermal vacuum test thermal stress test method. Background technique [0002] In satellite engineering, an antenna product applied to extreme low temperatures and high temperature environments is needed. According to the thermal environmental impact analysis, the antenna will undergo an extreme low temperature environment during the rail, due to the extremely temperature change, the thermal stress between the heat deformation between different material parts is very harsh. During the ground test, on the one hand, by simulation, the product is analyzed under different temperature conditions under different temperature conditions. In addition, in order to accurately assess the determination of the extreme temperature conditions, the product structure satisfies the need for rail application requirements, and it needs to be tested. Accurate assessment o...

AI Technical Summary

Problems solved by technology

Some test methods use directly added strain gauges placed in the air for compensation, which can compensate the test error caused by the strain gauge itself with temperature changes, but cannot eliminate the deformation caused by the normal thermal expansion and contraction of the product itself, and there are large errors in the stress test results

Images