A waterproof switch with intermittent heat dissipation

Abstract

The invention discloses a waterproof switch with intermittent heat dissipation, belonging to the field of switches. A waterproof switch with intermittent heat dissipation comprises a switch main body, a pair of circulating water tanks are fixedly connected to the side walls of the switch main body, and an air cooling device is fixedly connected to the top of the switch main body. The upper and lower ends of a pair of circulating water tanks are respectively connected with a heat dissipation pipe and a heat conduction pipe. The heat dissipation pipe and the heat conduction pipe respectively pass through the switch main body and the air cooling box. A partition board is connected between the switch main body and the air cooling box. There are a plurality of evenly distributed ventilation holes drilled on the upper part, a floating seal and a sealing plate are installed in the partition plate, a water retaining column is inserted into the sealing plate, one end of the water retaining column is fixedly connected with the floating sealing bag, and the other end of the water retaining column is inserted into the partition inside the board. When the switch is overheated, the width of the ventilation hole of the device can be automatically changed, the change of the ventilation volume of the switch can be realized, and the water resistance of the device can be ensured after the width of the ventilation hole is changed.

Description

technical field [0001] The present invention relates to the field of switches, and more particularly, to a waterproof switch with intermittent heat dissipation. Background technique [0002] A switch is a network device used for electrical (optical) signal forwarding. It can provide an exclusive electrical signal path for any two network nodes of the access switch. The most common switches are Ethernet switches, and other common ones are telephone voice switches, fiber switches, etc. A switch generally includes a motherboard and a chassis. When the switch performs electrical signal forwarding, especially when there are many network nodes connected, a lot of heat will be generated on the motherboard. In existing switches, heat dissipation holes are generally provided on one side of the case, and an air supply fan is installed on the other side to achieve heat dissipation. When there are many network nodes, multiple switches are often used. In order to reduce the footprint...

AI Technical Summary

Problems solved by technology

When the switch is working, the key components such as the slots of the main board generate heat, which needs to be dissipated in time. The existing switches generally dissipate heat through the cooling fan on the switch cabinet. The existing heat dissipation methods cannot dissipate the heat from the motherboard slot with a large amount of heat dissipation, and the heat dissipation is uneven, which affects the service life of the equipment

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