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Device packaging method and packaging structure packaged by applying packaging method

A technology of device packaging and packaging methods, which is applied in the direction of electric solid-state devices, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of high cost and complicated operation, and achieve the effect of convenient storage

Pending Publication Date: 2021-09-24
BLACKSHARK TECH NANCHANG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to overcome the above-mentioned technical defects, the purpose of the present invention is to provide a device packaging method and a packaging structure using the packaging method, which are used to solve the problem that the existing chip protection packaging method needs to be implemented with high-precision equipment, and the cost is high and the operation is complicated. The problem

Method used

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  • Device packaging method and packaging structure packaged by applying packaging method
  • Device packaging method and packaging structure packaged by applying packaging method
  • Device packaging method and packaging structure packaged by applying packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1: This embodiment provides a device packaging method for device protection, more specifically, mainly for chip protection. It should be noted that in this embodiment, the first surface and the second surface of the following circuit board The two sides are the opposite sides for mounting devices. The first and second sides are only used to distinguish, and the first and second devices are also only used to distinguish. They can be exchanged in specific implementation scenarios. Among them, the first A device and a second device include but are not limited to chips, crystal elements, etc. The following devices include the first device and the second device, and the execution order of steps S100-S300 and steps S400-S500 can be interchanged or synchronized Proceeding, non-directed step-by-step sequence, see figure 1 , including the following steps:

[0042] S100: printing solder paste on the first surface of the circuit board and mounting the first device;

...

Embodiment 2

[0069] Embodiment 2: This embodiment provides a packaging structure, see figure 2 and image 3 , including a circuit board 1, a first device 3 and a second device 3 mounted on both sides of the circuit board 1 by printing solder paste 2, and two pieces for respectively protecting the first device 3 and the second device 3 solid film 4;

[0070] Specifically, the first device 3 and the second device 3 include but are not limited to chips, crystal components, etc. As a supplement, the packaging structure can also be a collection of components composed of a plurality of circuit boards 1, each circuit board 1 has The first device 3 and the second device 3 and the solid film 4 for protecting the first device 3 and the second device 3 are bonded. The solid film 4 is used to package the first device and the second device using any one of the packaging methods described in the above embodiments.

[0071] Specifically, the first device 3 and the second device 3 are mounted after pr...

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Abstract

The invention provides a device packaging method and a packaging structure packaged by applying the packaging method, and relates to the field of device protection, and the method comprises the following steps: printing solder paste on a first surface of a circuit board, and mounting a first device; attaching a solid-state film to the side, away from the circuit board, of the first device; the circuit board with the solid film and the first device passing through a reflow oven, so that the solid film, the first device and the circuit board are tightly attached in sequence; printing solder paste on a second surface, opposite to the first surface, of the circuit board, and mounting a second device on the second surface; attaching a solid-state film to the side, away from the circuit board, of the second device; and the circuit board with the solid film and the second device passing through the reflow oven, and the solid film, the second device and the circuit board being tightly attached in sequence, so as to solve the problems that an existing chip protection packaging method needs to be realized by adding high-precision equipment, the cost is relatively high and the operation is complicated.

Description

technical field [0001] The invention relates to the field of device protection, in particular to a device packaging method and a packaging structure packaged using the packaging method. Background technique [0002] Packaging refers to placing the IC die on a substrate that acts as a load bearing, leading out the electrodes, and then fixing the package as a whole. In the conventional device packaging process, the printed circuit board is generally placed on the packaging substrate and then the chip is mounted, and the subsequent furnace is passed to form the package of the chip and the printed circuit board. Chip packaging is an extremely important part of the semiconductor industry. . [0003] Glass chip-scale packaging technology provides both a roadmap for performance improvement and a reduction in the size of integrated passive devices. However, when used in production, this kind of glass chip is prone to damage and cracks during transportation and turnover. It is diff...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/31H05K13/04
CPCH01L21/56H01L23/3157H05K13/0465
Inventor 庞峰
Owner BLACKSHARK TECH NANCHANG CO LTD