Single layer polymer films and electronic devices
A polymer film and single-layer technology, applied in printed circuits, electrical components, circuit substrate materials, etc., can solve the problems of difficult covering layers, low gloss, limiting the total thickness of multi-layer covering layers, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
example
[0127] testing method
[0128] CIE L*, a*, b* color
[0129] use Color measurements were performed in reflectance (including specular) mode with an XE dual-beam spectrophotometer (Hunter Associates Laboratory, Inc., Reston, VA). Instruments were standardized before each use. Color data from the instrument is reported as L*, a*, b* in the CIELAB 10° / D65 system. An L* value of 0 is pure black, while an L* value of 100 is pure white. Typically, a 1 unit difference in L* value is discernible to the eye.
[0130] Refractive index
[0131] use A model 2010 prism coupler (Metricon Corporation, Pennington, NJ) used a laser wavelength of 633 nm (632.8 nm) for refractive index measurements. Instruments were benchmarked before each use. Refractive index measurements were performed in transverse electrical mode to report the in-plane refractive index of the film.
[0132] gel fraction
[0133]The polyimide gel fraction is measured using the Soxhlet extraction method ...
example 3
[0163] For the polyamic acid (PAA) solution of Example 3 (E3) with a monomer composition of CBDA 0.6 / 6FDA 0.4 / / TFMB 1.0, to a 72 L nitrogen purged resin kettle, 2.268 kg of trifluoromethyl-benzidine was added (TFMB, Seika Corp., Wakayama Seika Kogyo Co., Ltd., Japan) together with 32.191 kg of DMAc. 1.252 kg of 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA, Daikin USA, Decatur, Ala. America Incorporated, Decatur, AL)) and 0.829 kg of cyclobutane dianhydride (CBDA, Wilshire Technologies, Princeton, NJ). The reaction mixture was maintained at 40°C during these additions. The polymer was polymerized ("processed") to 12 poise using a small addition of 6FDA powder.
[0164] For E3, to prepare a substantially imidized polyimide solution (polyimide amic acid solution), an additional 2.787 kg of DMAc was added and stirred for 60 minutes. 1.65 kg of β-picoline and 1.808 kg of acetic anhydride were combined with the PAA solution. The reaction mixture was heated to 80 °C fo...
example 4
[0168] For the polyamic acid (PAA) solution of Example 4 (E4) with BPADA 1.0 / / 3,4-ODA 1.0 monomer composition, to a 300 ml beaker in a nitrogen purged glove box, 5.56 g of 3,4 -Oxydiphenylamine (3,4-ODA, Seika Corp., Wakayama Seika Kogyo Co., Ltd., Japan) together with 180 g of DMAc. 14.415 g of BPADA was added in three equal portions at three 5-10 minute intervals. The reaction mixture was maintained at 40°C during these additions. Keep the reaction at 40 °C overnight until the weight average molecular weight M w =184,000 g / mol with a dispersity of 2.00.
[0169] For E4, to prepare a substantially imidized polyimide solution (polyimide amic acid solution), 10.34 g of β-picoline and 11.33 g of acetic anhydride were combined with the PAA solution. The reaction mixture was stirred at 40°C for 30 minutes, then heated to 80°C for 3 hours to imidize the solution. 200 g of the room temperature polymer solution was poured into 600 ml of methanol in a blender and stirred rapidly...
PUM
| Property | Measurement | Unit |
|---|---|---|
| surface roughness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| surface roughness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More