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Rapidly buildable movable sandwich layer structure of sandwich board and its expansion method

A sandwich panel and expansion method technology, applied in building components, building structures, buildings, etc., can solve problems such as poor load-bearing capacity, and achieve the effect of simple structure

Active Publication Date: 2022-04-12
FUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But it is not ideal to apply Miura-ori to this laminated structure, and its load-bearing capacity is not excellent, so a new origami structure is needed to realize the application of variable thickness sandwich board

Method used

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  • Rapidly buildable movable sandwich layer structure of sandwich board and its expansion method
  • Rapidly buildable movable sandwich layer structure of sandwich board and its expansion method
  • Rapidly buildable movable sandwich layer structure of sandwich board and its expansion method

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Embodiment Construction

[0026] In order to make the above-mentioned features and advantages of the present invention easier to understand, the following specific embodiments are described in detail with reference to the accompanying drawings, but the present invention is not limited thereto.

[0027] refer to Figure 1 to Figure 8

[0028] A movable sandwich layer structure of a sandwich board that can be quickly built, including several isosceles triangular modules Ⅰ, isosceles triangular modules Ⅱ and hexagonal modules with 4 connecting sides symmetrical to each other, isosceles triangular modules Ⅰ and isosceles triangular modules Module II is a similar triangle.

[0029] The isosceles triangle module has bottom connection side, left waist connection side, and right waist connection side. The angle between the edge and the bottom connecting edge is the right bottom angle. There are upper bottom connecting edge and lower bottom connecting edge in the hexagonal module, the sides adjacent to the low...

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Abstract

The invention relates to a fast-build movable sandwich layer structure of a sandwich board and an expansion method thereof, including several similar isosceles triangular modules I and II, and a hexagonal module with four symmetrical connecting sides. The bottom connecting edge of the non-edge isosceles triangular module is connected to the bottom connecting edge of another isosceles triangular module, and the two isosceles triangular modules are identical; the upper bottom connecting edge of the non-edge hexagonal module is connected to The upper connecting edge of another hexagonal module is connected, and the lower connecting edge of the non-edge hexagonal module is connected with the lower connecting edge of another hexagonal module, and the two hexagonal modules are identical ; When the isosceles triangle module is connected with the hexagon module, one hexagon module is connected with at most two isosceles triangle modules; sequentially connecting 4 hexagon modules and 2 isosceles triangle modules to form a single closed loop produces 1 Cutout rhombus. The structure changes the single-degree-of-freedom folding into a movable sandwich layer of the sandwich board, which can accurately and quickly change the thickness of the sandwich board to respond to emergencies in a timely manner.

Description

technical field [0001] The invention relates to a fast-build movable sandwich layer structure of a sandwich board and an expansion method thereof. Background technique [0002] Origami, an art listed as the quintessence of Japan, has received widespread attention from engineers in recent years, especially Miura-ori. This origami model can be folded from a two-dimensional plane state to a three-dimensional state with a single degree of freedom, and then folded again. It presents a new two-dimensional plane state. This structure has been applied to the solar panels of aerospace vehicles in some projects, and some people have studied its three-dimensional state as the sandwich layer of the sandwich panel, which can realize the variable thickness of the sandwich panel. However, applying Miura-ori to this laminated structure is not ideal, and its load-bearing capacity is not excellent, so a new origami structure is needed to realize the application of variable thickness sandwich...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04C2/30E04C2/34B32B33/00B32B3/08B32B3/06
CPCE04C2/30E04C2/34E04C2/3405B32B33/00B32B3/08B32B3/06
Inventor 杨富富林维炜陈昆精张俊
Owner FUZHOU UNIV
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