Electronic package, supporting structure and manufacturing method thereof
A technology for electronic packaging and supporting structures, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., and can solve problems such as damage to the protective layer, tin channeling, and easy overflow of solder material 13, so as to avoid tin channeling , to avoid the effect of short circuit
Pending Publication Date: 2021-09-28
SILICONWARE PRECISION IND CO LTD
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Problems solved by technology
[0008] However, in the existing manufacturing method of the semiconductor package 1, the flux 17 will be in a liquid state during the high-temperature process, causing it to penetrate into the protective layer 19 along the side of the conductive pillar 150, thus destroying the protective layer 19, so When the solder material 13 is reflowed, the protective layer 19 is no longer present on the sides of the lead frame 15 and its conductive pillars 150, causing the solder material 13 to overflow easily and cause tin channeling, such as Figure 1B ’, so that the subsequent solder material 13 is electrically connected to the first semiconductor chip 11 and a short circuit occurs
Method used
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[0049] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
[0050] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation of the present invention. condition, so it has no technical substantive meaning, and any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of the present invention without affecting the effect and purpose of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and "one" quoted in...
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An electronic package, and a supporting structure and a manufacturing method thereof are disclosed. The supporting structure forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.
Description
technical field [0001] The invention relates to a package structure and manufacturing process, especially to an electronic package and its supporting structure and manufacturing method. Background technique [0002] With the vigorous development of portable electronic products in recent years, various related products are gradually developing towards the trend of high density, high performance, lightness, thinness, shortness and smallness. The structure of the semiconductor package is thus coordinated with the innovation in order to meet the requirements of light, thin, small and high density. [0003] Figure 1A to Figure 1D It is a schematic cross-sectional view of the manufacturing method of the conventional semiconductor package 1 . [0004] like Figure 1A As shown, a lead frame 15 is provided, which includes a support plate 152 , and a plurality of conductive pillars 150 and a bonding pad 151 spaced apart on the support plate 152 . [0005] like Figure 1B As shown...
Claims
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IPC IPC(8): H01L23/495H01L21/48H01L21/60
CPCH01L23/49582H01L21/4821H01L24/80H01L21/4832H01L21/4853H01L23/49811H01L23/49513H01L2224/16225H01L2924/181H01L2924/19107H01L2924/19105H01L2924/00012H01L21/4842H01L23/49872
Inventor 张卓兴方颢儒纪廷伟朱德芳简顺裕
Owner SILICONWARE PRECISION IND CO LTD