Manufacturing method and circuit board of high heat dissipation special printed circuit board for video transmission

Abstract

The invention relates to a method for manufacturing a high heat dissipation special printed circuit board for video transmission and the circuit board, comprising the steps of: making the first surface of the circuit board as a thick copper layer, the thick copper layer being copper whose thickness is greater than that of the copper completed by the design data Layer, make stepped copper blocks, make stepped tanks, place the stepped copper blocks in the stepped tanks, process the remaining tanks with copper paste, and perform low-temperature baking, and then perform pressing and post-baking processing. Then through deep drilling first, then deep milling and etching to remove excess parts, and finally grinding to form a circuit board; this method is to fine-process the copper block, and use aluminum sheet to plug copper paste to strengthen and fix the copper block, and then through control Deep drilling, controlled deep milling, and etching are used to remove parts, which can provide a clear process processing method for special printed circuit boards with mixed voltage and high heat dissipation characteristics, and effectively avoid tilting, skewing, and poor pressing of stepped copper blocks. question.

Description

technical field [0001] The invention relates to the technical field of manufacturing special printed circuit boards, in particular to a method for manufacturing a special printed circuit board with high heat dissipation for video transmission and a circuit board. Background technique [0002] With the rapid development of high-speed networks such as 5G networks and optical fibers, the video industry has also ushered in another peak development period. Driven by video-related industries such as online education, live broadcast industry, and short video industry, video transmission has become more and more important to hardware equipment. The requirements are also getting higher and higher; at present, the video format of large-capacity and high-speed transmission has been formed, and the circuit board, the most basic component of electronic products, also needs to be updated accordingly. [0003] A class of large-capacity, high-speed transmission video electronic equipment, s...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is that for the current special printed circuit boards that include material mixed pressure design and high heat dissipation embedded stepped copper block design, it is easy to cause inclination, skew, and poor pressing when embedding the stepped copper block. Problem, based on this, the present invention proposes the following solutions:

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