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Device for heat dissipation and electronic device thereof

A technology for heat-generating devices and heat-dissipating components, which is applied to electrical components, structural parts of electrical equipment, cooling/ventilation/heating transformation, etc., and can solve problems such as strict requirements on overall size, inability to adapt heat dissipation measures, and changes in heat dissipation space , to achieve the effect of solving the change of heat dissipation space, occupying a small space, and reducing the requirements for manufacturing precision

Pending Publication Date: 2021-09-28
CAMBRICON TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, different heating devices usually have different sizes and specifications, and traditional heat dissipation measures cannot be flexibly adapted to them
At the same time, the development of artificial intelligence products tends to be miniaturized and lightweight, that is, there are strict requirements on the overall size of the product, which makes many traditional heat dissipation measures that take up a lot of space unusable
In some application scenarios, the structural or dimensional tolerance of the heat-generating device will also lead to changes in the heat dissipation space, and it is difficult to adjust the traditional heat dissipation measures according to the changes. Therefore, improving the tolerance of heat dissipation measures is also an urgent need to be solved in the field of heat dissipation technology question

Method used

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  • Device for heat dissipation and electronic device thereof
  • Device for heat dissipation and electronic device thereof
  • Device for heat dissipation and electronic device thereof

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Embodiment Construction

[0021] The technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present disclosure, but not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present disclosure.

[0022] The present disclosure provides a brand new and realizable solution to the deficiencies of the prior art. In particular, the heat dissipation device of the present disclosure may be composed of a heat dissipation housing and at least one flexible heat dissipation component, through which the flexible heat dissipation component is in contact with the heating device and transfers the heat emitted by the heating device to the heat dissipation housing, solving the problem of heat dissipation of the he...

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Abstract

The present disclosure discloses a device for heat dissipation and an electronic device thereof, and a device (300) may comprise a heat dissipation housing (310) having an inner cavity (311) for accommodating a heat emitting device and at least one opening (312); and at least one flexible heat dissipation assembly (320) which is connected with the heat dissipation shell (310) and is in contact with the heating device. According to the device disclosed by the invention, the heat dissipation problem of the heating device can be effectively solved, and the device has the characteristics of simple structure, small occupied space and the like.

Description

technical field [0001] The present disclosure relates generally to the field of heat dissipation. More specifically, the present disclosure relates to a device for dissipating heat and an electronic device thereof. Background technique [0002] At present, electronic information technology and artificial intelligence technology are developing rapidly. The internal devices of electronic and artificial intelligence products related to these technologies usually have the characteristics of large heating power consumption and sharp rise in device temperature, which affects the reliability and life of the product. In addition, different heat generating devices usually have different sizes and specifications, and traditional heat dissipation measures cannot be flexibly adapted to them. At the same time, the development of artificial intelligence products tends to be miniaturized and lightweight, that is, there are strict requirements on the overall size of the product, which make...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20454H05K7/20409
Inventor 不公告发明人
Owner CAMBRICON TECH CO LTD