Vapor chamber and terminal equipment

The technology of a temperature equalizing plate and a cover plate is applied in the directions of heat exchange equipment, lighting and heating equipment, electrical equipment structural parts, etc.

Active Publication Date: 2021-10-01
QINGDAO HISENSE MOBILE COMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At the same time, more and more bendable electronic devices are used in existing terminal equipment, such as mobile phones with bendable screens, which are showing a vigorous development trend, but the vapor chambers used in existing electronic devices cannot be directly applied On bendable electronics, this makes heat dissipation more difficult for bendable electronics

Method used

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  • Vapor chamber and terminal equipment
  • Vapor chamber and terminal equipment
  • Vapor chamber and terminal equipment

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Embodiment Construction

[0029] In the following, the present invention will be specifically described through exemplary embodiments. It should be understood, however, that elements, structures and characteristics of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0030] In describing the present invention, it is to be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying References to devices or elements must have a particular orientation, be constructed, and operate in a particular orientation and therefore should not be construed as limiting the invention.

[0031] The terms "fi...

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PUM

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Abstract

The invention provides a vapor chamber and terminal equipment. The vapor chamber comprises a first cover plate and a second cover plate; a recessed part is arranged on the first cover plate, and the recessed part is recessed towards the interior of the vapor chamber; and the second cover plate is connected with the first cover plate in a sealed manner so as to form a sealed containing cavity, and the recessed part is connected to the second cover plate in an abutting manner. The vapor chamber has the beneficial effects that the first cover plate is provided with the recessed part, so that when the vapor chamber is bent, the top end of the recessed part can be connected to the second cover plate in the abutting manner, and the circulation efficiency of the sealed containing cavity is improved. According to the terminal equipment, heat dissipation of a telescopic screen of the terminal equipment can be met, and bending of the vapor chamber is more convenient.

Description

technical field [0001] The invention belongs to the technical field of terminals, and in particular relates to a uniform temperature plate and terminal equipment. Background technique [0002] In the prior art, the gas-liquid circulation circuit of the vapor chamber is mostly relatively simple. After the steam condenses in the vapor chamber, it needs to pass through the capillary structure around the vapor chamber to flow back to the heat source position of the vapor chamber. In some application scenarios, the heating vapor chamber needs higher circulation efficiency to obtain better heat transfer effect. [0003] At the same time, more and more bendable electronic devices are used in existing terminal equipment, such as mobile phones with bendable screens, which are showing a vigorous development trend, but the vapor chambers used in existing electronic devices cannot be directly applied On bendable electronic devices, this makes it more difficult to dissipate heat from be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04F28F21/00F28F21/08H05K7/20
CPCF28D15/046F28F21/085F28F21/00H05K7/20336Y02D10/00
Inventor 王瑾瑾
Owner QINGDAO HISENSE MOBILE COMM TECH CO LTD
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