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Three-dimensional grid reconstruction method and device, electronic device and storage medium

A technology of 3D grid and 3D model, which is applied in the field of 3D scanning, can solve the problem of occupying a lot of storage resources and computing resources, and achieve the effect of improving efficiency, purpose and advantages of being concise and easy to understand

Active Publication Date: 2021-10-01
SCANTECH (HANGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In this embodiment, a 3D grid reconstruction method, device, electronic device and storage medium are provided to solve the problem of occupying more storage resources and computing resources in related technologies

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  • Three-dimensional grid reconstruction method and device, electronic device and storage medium
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  • Three-dimensional grid reconstruction method and device, electronic device and storage medium

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Embodiment Construction

[0047] In order to understand the purpose, technical solution and advantages of the present application more clearly, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments.

[0048] Unless otherwise defined, the technical terms or scientific terms involved in the application shall have the general meanings understood by those skilled in the technical field to which the application belongs. In this application, words like "a", "an", "an", "the", "these" and the like do not denote quantitative limitations, and they may be singular or plural. The terms "comprising", "comprising", "having" and any variant thereof referred to in this application are intended to cover non-exclusive inclusion; for example, processes, methods and The system, product or device is not limited to the steps or modules (units) listed, but may include steps or modules (units) not listed, or may include other steps or modules inherent to the ...

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Abstract

The invention relates to a three-dimensional grid reconstruction method and device, an electronic device and a storage medium, and the three-dimensional grid reconstruction method comprises the steps: obtaining the position information of a voxel corresponding to updated point cloud data of a to-be-reconstructed object, determining a patch set of the voxel corresponding to the updated point cloud data according to the position information, determining a first conversion relation according to a preset strategy, representing overlapped edges of adjacent surface patches by using the same coordinate data according to the first conversion relation to obtain a processed surface patch set, and determining a three-dimensional model of a to-be-reconstructed object according to the processed surface patch set, with the first conversion relation comprising a conversion relation of each edge in voxels. The problem that more storage resources are occupied is solved, and reconstruction of the three-dimensional grid is achieved.

Description

technical field [0001] The present application relates to the field of three-dimensional scanning, in particular to a three-dimensional mesh reconstruction method, device, electronic device and storage medium. Background technique [0002] The most important part of a 3D scanner is the camera. When scanning, the 2D image information is obtained through the camera, and then the 3D information is reconstructed. Before reconstructing the 3D information of the object, it is usually necessary to generate a surface grid on the surface of the object, and then use the surface grid The 3D information of the object is reconstructed based on the grid. [0003] The existing surface mesh generation methods need to regenerate all the surface mesh information every time the scanning data is updated, which requires more storage resources and computing resources. [0004] Aiming at the problem that storage resources and computing resources are occupied in related technologies, no effective ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06T17/20
CPCG06T17/205
Inventor 王江峰霍旺
Owner SCANTECH (HANGZHOU) CO LTD
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