Interference layer system without carrier substrate, method for producing same, and use thereof
A carrier substrate and interference layer technology, applied in the field of interference layer system, can solve the problem of limited spectral characteristics adjustment
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[0222] example
[0223] In the Satisloh 1200-DLF coating unit, an extensive substrate material in the form of a plastic substrate coated with polysiloxane-based hardcoat material MP-1154D (SDC TECHNOLOGIES, INC.) was used as A carrier base material is provided.
[0224] The plastic base material was an uncoated ophthalmic lens made of CR39 polymer and had a circular diameter of 6.5 cm, and a median thickness of 1.5 mm. First, primer PR-1156 (SDC TECHNOLOGIES, INC.) was applied to the plastic base material by dip coating in a layer thickness of 750 nm. Dry in a ULE 600 upright oven at 70 °C for 5 min at D-91126 Memmert GmbH + Co. KG, Schwabach, Germany. The polysiloxane-based hardcoat material MP-1154D was subsequently applied by dip coating with a layer thickness of 2500 nm. It was then dried and cured for 120 minutes at a temperature of 110°C in a ULE 600 upright oven of the company D-91126 Memmert GmbH + Co. KG in Schwabach, Germany.
[0225] Before the actual deposition...
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