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Plasma Antenna Module

A plasma antenna and assembly technology, applied in the direction of circuits, discharge tubes, electrical components, etc., can solve the problem that the substrate cannot be processed uniformly

Active Publication Date: 2022-04-12
GIGALANE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, the plasma density is formed differently depending on the position of the substrate, and the substrate may not be processed uniformly

Method used

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Embodiment Construction

[0049] Specific embodiments for realizing the idea of ​​the present invention will be described in detail below with reference to the accompanying drawings.

[0050] Meanwhile, in describing the present invention, when it is judged that a specific description of a related known configuration or function may make the gist of the present invention unclear, the detailed description thereof is omitted.

[0051] Furthermore, when referring to a constituent element being "connected," supporting," "inflowing," "supplying," "flowing," or "incorporating" another constituent element, it may also directly connect, support, flow into, supply, flow , combined with this other constituent element, but it should be understood that there may be other constituent elements in between.

[0052] The terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Expressions in the singular include expressions in the plural unle...

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Abstract

The invention relates to a plasma antenna module. Specifically, according to an embodiment of the present invention, a plasma antenna module is provided, including: an inner coil assembly, at least a part of which extends on a virtual plane, and is capable of flowing a first current; an outer coil assembly having a shape spaced from the inner coil assembly and extending in a direction surrounding the inner coil assembly when viewed from a direction perpendicular to the virtual plane, and capable of causing a second current to flow; and an inductor electrically connected to the outer layer coil assembly and the inner layer coil assembly, and the inductor is configured to be able to change the path of the current flowing through the inductor to adjust the first current and the The magnitude of the second current.

Description

technical field [0001] The invention relates to a plasma antenna module. Background technique [0002] Generally, semiconductor devices can be fabricated by performing various processes on a substrate. For example, various processes for processing the substrate may include processes such as etching, deposition, thermal treatment, and imprint lithography. In particular, an operation in which a substrate can be etched by using plasma (Plasma) generated by a plasma processing apparatus may be performed in the etching process. [0003] On the other hand, the plasma processing apparatus generally includes an Inductively Coupled Plasma Source (ICP) type, a Capacitively Coupled Plasma Source (CCP) type, an Electro Cyclotron Resonance Plasma Source (Electro Cyclotron Resonance PlasmaSource) , ECR) type and helicon plasma source type (Helicon Plasma Source). [0004] Such a plasma processing apparatus can convert a process gas into a plasma state by reacting a process gas with a h...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32
CPCH01J37/3211H01J37/32091H01J37/3222
Inventor 蔡熙星金亨源郑熙锡
Owner GIGALANE CO LTD