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Thermoelectric conversion arrangement

A thermoelectric conversion and electrical technology, applied in lighting and heating equipment, thermoelectric devices that only use the Peltier or Seebeck effect, machines that use electric/magnetic effects, etc., can solve the problems that the efficiency cannot provide thermoelectric conversion devices, etc., and achieve system design easy effect

Inactive Publication Date: 2004-01-21
THERMOVONICS
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0032] In such conventional thermal calculations, for example, there is a design concept of treating the entire system such as an electronic refrigerator as a heat transfer (flow), and as mentioned above, the design and manufacturer side conducts thermal calculations and manufactures electronic refrigeration components as a single unit. Electronic refrigeration components of various sizes. In addition, on the user side, due to the selection of appropriate components from the prepared electronic refrigeration components for additional thermal calculations, the components in systems such as electronic refrigerators are not considered as the most efficient operation. A design concept of electronic refrigeration components that are necessary, as a result, it is impossible to provide a thermoelectric conversion device suitable for the system (application) in terms of efficiency

Method used

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Embodiment Construction

[0094] Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0095] Figure 5 It is a block diagram showing a schematic configuration of a thermoelectric conversion device. The thermoelectric conversion device shown in this figure is composed of an electronic cooling element and a heat-absorbing-side thermal conductor (the thermal conductor on the left side in the figure) and a heat-dissipating-side thermal conductor (the thermal conductor on the right side in the figure) respectively bonded to both sides of the electronic cooling element. heat conductor) and has a structure that utilizes the Peltier effect to absorb heat from the left side and release heat from the right side according to the drawing.

[0096] In such a structure, the cross-sectional area of ​​the electronic refrigeration element is taken as the unit cross-sectional area (1 (cm 2 )), and the thermal conductivity (thermal conductance) equivale...

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Abstract

A thermoelectric converter is composed of a number of p-type semiconductor chips and n-type semiconductor chips arranged side by side and electrically connected in series, a heat-absorbing-side heat conductor arranged on a heat-absorbing side of the p-type and n-type semiconductor chips, a heat-dissipating-side heat conductor arranged on a heat-dissipating side of the p-type and n-type semiconductor chips, and a device for feeding a current to the p-type and n-type semiconductor chips, which is characterized in that current density is raised when the semiconductor layers 14 and 15 are thin, and current density is adjusted to be lower when they are thick. The aim of the present invention is to provide a thermoelectricity converting device wherein high COP is provided surely and further the system design is easy.

Description

technical field [0001] The present invention relates to a thermoelectric conversion device used in an electronic refrigeration device such as an electronic refrigerator, a dehumidifier, or an air conditioner (air conditioner). Background technique [0002] An element that passes electric energy through a thermoelectric conversion element to cool a specified item is called a Peltier element or an electronic refrigeration element, and is used, for example, in a small freezer as a refrigeration technology that does not use refrigerants such as Freon. attract attention. [0003] Previous electronic refrigeration components such as Figure 56 As shown, a heat-absorbing side electrode 102 is provided on a heat-absorbing-side insulating substrate 100 made of alumina or the like through a heat-absorbing solder layer 101, and a P-type semiconductor layer 103 and an N-type semiconductor layer 103 are respectively arranged on the heat-absorbing side electrode 102. semiconductor layer ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02H01L35/30H01L35/32
CPCF25B2321/025F25B2321/023F25B21/02H01L35/30H10N10/13
Inventor 渡辺日出男小川吉彦酒井一成久野文雄手塚弘房木谷文一
Owner THERMOVONICS