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Photomask preparation method and photomask

A photomask and pattern alignment technology, which is applied in the photoengraving process of the pattern surface, the original for optical mechanical processing, optics, etc. Quality, quantity reduction effect

Pending Publication Date: 2021-10-22
CHANGXIN MEMORY TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the rapid development of integrated circuit manufacturing technology, the requirements for the integration of semiconductor products are getting higher and higher, and the number of semiconductor devices distributed in a unit area is increasing, resulting in higher and higher requirements for pattern alignment. Make a large number of alignment patterns on the surface to check the quality of the mask, which takes up a lot of mask area

Method used

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  • Photomask preparation method and photomask
  • Photomask preparation method and photomask
  • Photomask preparation method and photomask

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Embodiment Construction

[0034] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. A preferred embodiment of the application is shown in the drawings. However, the present application can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of this application more thorough and comprehensive.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are only for the purpose of describing specific embodiments, and are not intended to limit the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associa...

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Abstract

The embodiment of the invention relates to a photomask preparation method and a photomask. The method comprises the steps of: providing a test photomask which is provided with a plurality of chip function regions, and forming a plurality of alignment patterns and chip function patterns in the chip function regions; acquiring offset data of the alignment patterns; determining a plurality of clustering areas according to the offset data of the alignment patterns; and determining the position and the number of target alignment patterns according to the clustering areas, and preparing a target photomask according to the target alignment patterns and the chip function patterns. According to the invention, the number of alignment patterns can be reduced, and the photomask detection quality can be ensured.

Description

technical field [0001] The embodiments of the present application relate to the technical field of semiconductor manufacturing, and in particular to a method for preparing a photomask and the photomask. Background technique [0002] With the rapid development of integrated circuit manufacturing technology, the requirements for the integration of semiconductor products are getting higher and higher, and the number of semiconductor devices distributed in a unit area is increasing, resulting in higher and higher requirements for pattern alignment. A large number of alignment patterns are made on the surface to check the quality of the mask, which takes up a lot of mask area. Contents of the invention [0003] Embodiments of the present application provide a method for preparing a photomask and a photomask capable of reducing the number of alignment patterns while ensuring the inspection quality of the photomask. [0004] According to some embodiments, an aspect of the presen...

Claims

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Application Information

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IPC IPC(8): G03F1/42G03F1/44
CPCG03F1/42G03F1/44
Inventor 孙筱雨
Owner CHANGXIN MEMORY TECH INC