Semiconductor process equipment, cooling assembly thereof and cooling method

Abstract

The invention provides a cooling assembly which comprises a temperature sensing device, a cooling device and a control device, the control device obtains a temperature detection value of an electric control device in semiconductor process equipment through the temperature sensing device, and a processor of the control device is used for controlling the cooling device to cool the electric control device when the temperature detection value meets a preset high-temperature condition or the electric control device runs.. In the aspect, the processor of the control device can control the cooling device to start to cool the electric control device when the electric control device runs or the temperature detection value of the electric control device meets the preset high-temperature condition, so that the electric control device is cooled only when the electric control device has the cooling requirement; the potential safety hazard that liquid drops are generated by condensation in the electric control device due to the fact that redundant cooling is continuously carried out on the electric control device when the temperature of the electric control device is low is eliminated, and the safety of semiconductor process equipment is improved. The invention also provides semiconductor process equipment and a cooling method.

Description

technical field [0001] Embodiments of the present invention relate to the field of semiconductor processing equipment, and in particular, relate to a cooling assembly, a semiconductor processing equipment including the cooling assembly, and a cooling method implemented by the cooling assembly. Background technique [0002] In the semiconductor process, the performance of the radio frequency power supply has a crucial influence on the process effect. The power of the radio frequency power supply used in the semiconductor process equipment is generally several hundred watts to several kilowatts. Due to the high output power of the radio frequency power supply, its output is radio frequency The extra work other than the energy of the signal is dissipated in the form of heat, which can easily cause the temperature of the RF power supply to be too high and burn out some temperature-sensitive devices. Therefore, it is necessary to take cooling measures for the RF power supply. [...

AI Technical Summary

Problems solved by technology

[0002] In the semiconductor process, the performance of the radio frequency power supply has a crucial influence on the process effect. The power of the radio frequency power supply used in the semiconductor process equipment is generally several hundred watts to several kilowatts. Due to the high output power of the radio frequency power supply, its output is radio frequency The extra work other than the energy of the signal is dissipated in the form of heat, which can easily cause the temperature of the RF power supply to be too high and burn out some temperature-sensitive devices. Therefore, it is necessary to take cooling measures for the RF power supply

[0003] In the prior art, water cooling is generally used to cool down the RF power supply. However, although long-term water cooling can avoid overheating, due to the temperature and humidity of the RF power supply environment, condensation may occur inside the RF power supply. The generated water droplets falling on the circuit board will cause a short circuit and further burn the power supply, causing huge economic losses and even threatening other equipment and staff around the RF power supply

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