A device for removing ic chip silk screen for built-in mobile phone accessories

A technology for mobile phone accessories and screen printing, which is applied to grinding drive devices, grinding machine parts, grinding automatic control devices, etc., can solve problems such as large operation volume and hidden safety hazards.

Active Publication Date: 2022-07-08
深圳市光明区琪琪电子加工店
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the disadvantages in the prior art that the placement of the chip requires a large amount of operation, and at the same time, the manual push of the placement plate and the contact with the grinding wheel will cause a certain safety hazard, the technical problem of the present invention is: to provide a machine to scrape the chip , reduce the amount of manual operation, and at the same time reduce the potential safety hazards caused by the contact between human hands and grinding wheels. Built-in IC chip silk screen removal device for mobile phone accessories

Method used

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  • A device for removing ic chip silk screen for built-in mobile phone accessories
  • A device for removing ic chip silk screen for built-in mobile phone accessories
  • A device for removing ic chip silk screen for built-in mobile phone accessories

Examples

Experimental program
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Effect test

Embodiment 1

[0037] An IC chip silk screen removing device for built-in mobile phone accessories, such as Figure 1 to Figure 6 As shown, it includes a base 1, a start switch 3, a protective cover 4, a mounting seat 5, a first drive motor 6, a grinding wheel 7, a placement assembly 8 and an automatic feeding mechanism 9, and a start switch 3 is provided on the front right side of the base 1, A protective cover 4 is connected to the top of the base 1, a mounting seat 5 is provided on the right side of the inner wall of the protective cover 4, a first drive motor 6 is provided on the left side of the mounting seat 5, and a grinding wheel 7 is rotatably provided on the left side of the top inner wall of the protective cover 4 for grinding. The right side of the wheel 7 is connected with the first driving motor 6 , and a placing component 8 is arranged on the top of the base 1 , and an automatic feeding mechanism 9 is arranged on the placing component 8 .

[0038] The placement assembly 8 incl...

Embodiment 2

[0042] On the basis of Example 1, as figure 1 , figure 2 , Figure 7 , Figure 8 and Figure 9 As shown, it also includes an anti-stacking mechanism 10, and the anti-stacking mechanism 10 includes a mounting bracket 101, an anti-stacking plate 102 and a first limit spring 103, and the front inner wall of the protective cover 4 is connected between the left and right sides of the installation bracket 101. In the bracket 101 , the bottom of the mounting bracket 101 is slidably provided with an anti-stacking plate 102 , and a first limit spring 103 is symmetrically connected between the anti-stacking plate 102 and the bottom of the mounting bracket 101 .

[0043] It also includes an epicyclic disc clamping mechanism 11. The epicyclic disc clamping mechanism 11 includes a limiting column 111, a second limiting spring 112 and a clamping block 113. The left and right sides of the placing table 84 are provided with limiting columns 111, and the placing platform 84 The left and r...

Embodiment 3

[0046] On the basis of Example 2, as figure 1 , figure 2 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 As shown, it also includes a dust suction mechanism 12. The dust suction mechanism 12 includes a mounting groove plate 121, a support frame 122, a mounting cover 123, a fan 124, a dust collecting box 125 and a smoke sensor 126. The top of the protective cover 4 is provided with a mounting groove. Plate 121, four support brackets 122 are arranged at equal distances on the rear side of the installation groove plate 121, and an installation cover 123 is connected between the support brackets 122. The rear side of the inner wall of the installation cover 123 is rotatably provided with a fan 124. The bottom of the installation cover 123 and the protective cover A dust collecting box 125 is connected between the tops of 4, and a smoke sensor 126 is connected to the bottom of the front side of the installation groo...

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PUM

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Abstract

The invention relates to a removal device, in particular to an IC chip silk screen removal device for built-in mobile phone accessories. The main purpose is to provide a built-in IC chip silk screen removal device for mobile phone accessories, which relies on machines to scrape the chip, reduces the amount of manual operations, and reduces the safety hazard caused by the contact between the human hand and the grinding wheel. An IC chip silk screen removal device for built-in mobile phone accessories, comprising: a base, a start switch, a protective cover, a mounting seat, a first drive motor and a grinding wheel, a start switch is provided on one side of the base, and a protective cover is connected on the top of the base to protect the One side of the inner wall of the cover is provided with a mounting seat, one side of the mounting seat is provided with a first driving motor, and one side of the top side of the inner wall of the protective cover is rotatably provided with a grinding wheel for grinding and removing the silk screen. The rotation of the screw rod drives the turntable and the IC chip to move back and forth through the connecting plate. At the same time, the grinding wheel rotates and contacts the surface of the IC chip to realize the grinding and removal of the silk screen and realize the basic functions.

Description

technical field [0001] The invention relates to a removal device, in particular to an IC chip silk screen removal device for built-in mobile phone accessories. Background technique [0002] With the development of mobile phone technology, the integration of chips on mobile phone motherboards is getting higher and higher. At present, the performance of chips will be tested before factory installation. Some chip units may fail the test due to their own defects. Chip units that do not pass the test cannot usually be used directly. Therefore, these chip units are cut off from the wafer before plastic sealing and eliminated and discarded. The defective chip units tested are directly scrapped, which not only causes pollution to the environment, It also reduces the economic benefits of the enterprise, so the chips need to be recycled. [0003] Before recycling, the silk screen on the surface needs to be removed, marked as waste chips, a certain number of chips are placed on the pl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/033B24B41/00B24B41/06B24B47/12B24B51/00B24B55/06B24B55/12H01L21/304
CPCB24B27/033B24B51/00B24B47/12B24B41/06B24B41/005B24B55/06B24B55/12H01L21/304
Inventor 刘春景
Owner 深圳市光明区琪琪电子加工店
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