IC chip silk screen removing device for built-in mobile phone accessories

A technology of mobile phone accessories and silk screen printing, which is applied in the direction of grinding drive devices, grinding machine parts, grinding automatic control devices, etc., and can solve problems such as large amount of operation and potential safety hazards

Active Publication Date: 2021-11-05
深圳市光明区琪琪电子加工店
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the disadvantages in the prior art that the placement of the chip requires a large amount of operation, and at the same time, the manual push of the placement plate and the contact with the grinding wheel will cause a certain safety hazard, the technical problem of the present invention is: to provide a machine to scrape the chip , reduce the amount of manual operation, and at the same time reduce the potential safety hazards caused by the contact between human hands and grinding wheels. Built-in IC chip silk screen removal device for mobile phone accessories

Method used

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  • IC chip silk screen removing device for built-in mobile phone accessories
  • IC chip silk screen removing device for built-in mobile phone accessories
  • IC chip silk screen removing device for built-in mobile phone accessories

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A built-in mobile phone accessories IC chip silk screen removal device, such as Figure 1 to Figure 6 As shown, it includes a base 1, a start switch 3, a protective cover 4, a mounting seat 5, a first drive motor 6, a grinding wheel 7, a placement component 8 and an automatic feeding mechanism 9, and a start switch 3 is provided on the front right side of the base 1. The top of base 1 is connected with protective cover 4, the right side of protective cover 4 inner wall is provided with mounting seat 5, the left side of mounting seat 5 is provided with first drive motor 6, and protective cover 4 inner wall top left side rotary type is provided with grinding wheel 7, grinding The right side of the wheel 7 is connected with the first driving motor 6, and the top of the base 1 is provided with a placement assembly 8, and the placement assembly 8 is provided with an automatic feeding mechanism 9.

[0038] Placing assembly 8 includes guide rail frame 81, guide bracket 82, con...

Embodiment 2

[0042] On the basis of Example 1, such as figure 1 , figure 2 , Figure 7 , Figure 8 and Figure 9 As shown, it also includes an anti-stacking mechanism 10. The anti-stacking mechanism 10 includes a mounting bracket 101, an anti-stacking plate 102 and a first limit spring 103, and a mounting bracket is connected between the left and right sides of the front inner wall of the protective cover 4. The bracket 101 and the bottom of the mounting bracket 101 are slidingly provided with an anti-stacking plate 102 , and a first limit spring 103 is symmetrically connected between the anti-stacking plate 102 and the bottom of the mounting bracket 101 .

[0043] Also include a turntable clamping mechanism 11, the turntable clamping mechanism 11 includes a limit column 111, a second limit spring 112 and a clamping block 113, the left and right sides of the placing platform 84 are provided with a limiting column 111, and the placing platform 84 Both left and right sides are slidingly...

Embodiment 3

[0046] On the basis of Example 2, such as figure 1 , figure 2 , Figure 10 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 and Figure 17 As shown, a dust suction mechanism 12 is also included, and the dust suction mechanism 12 includes a mounting groove plate 121, a support frame 122, a mounting cover 123, a fan 124, a dust collection box 125 and a smoke sensor 126, and the top of the protective cover 4 is provided with a mounting groove Plate 121, four support frames 122 are equidistantly arranged on the rear side of the installation groove plate 121, and installation covers 123 are connected between the support frames 122, and fans 124 are arranged on the rear side of the installation cover 123 inner wall, and the bottom of the installation cover 123 is connected with the protective cover A dust collection box 125 is connected between the tops of the 4, and a smoke sensor 126 is connected to the bottom of the front side of the installa...

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Abstract

The invention relates to a removing device, in particular to an IC chip silk screen removing device for built-in mobile phone accessories. According to the IC chip silk screen removing device for the built-in mobile phone accessories, a chip is stricken by means of a machine, the manual operation amount is reduced, and meanwhile potential safety hazards caused by the fact that hands make contact with a polishing wheel are reduced. The IC chip silk screen removing device for the built-in mobile phone accessories comprises a base, a starting switch, a protection cover, a mounting base, a first driving motor and a polishing wheel, the starting switch is arranged on one side of the base, the protection cover is connected to the top of the base, the mounting base is arranged on one side of the inner wall of the protection cover, the first driving motor is arranged on one side of the mounting base, and the polishing wheel for polishing and removing a silk screen is rotatably arranged on one side of the top of the inner wall of the protection cover. A lead screw rotates to drive a turnover disc and an IC chip to move back and forth through a connecting plate, meanwhile, the polishing wheel rotates to make contact with the surface of the IC chip, and therefore the silk screen can be polished and removed, and the basic function is achieved.

Description

technical field [0001] The invention relates to a removing device, in particular to an IC chip silk screen removing device for built-in mobile phone accessories. Background technique [0002] With the development of mobile phone technology, the integration of chips on the main board of mobile phones is getting higher and higher. At present, the performance of chips will be tested before they are installed in the factory. Some chip units may fail the test due to their own defects. Chip units that have not passed the test usually cannot be used directly. Therefore, these chip units are cut off from the wafer before plastic packaging and are eliminated and discarded. The defective chip units tested are directly scrapped, which pollutes the environment. It also reduces the economic benefits of the enterprise, so it is necessary to recycle the chips. [0003] Before recycling, it is necessary to remove the silk screen on its surface, which is marked as waste chips. Place a certa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B27/033B24B41/00B24B41/06B24B47/12B24B51/00B24B55/06B24B55/12H01L21/304
CPCB24B27/033B24B51/00B24B47/12B24B41/06B24B41/005B24B55/06B24B55/12H01L21/304
Inventor 刘春景
Owner 深圳市光明区琪琪电子加工店
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