Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A transfer type chip packaging device

A technology of chip packaging and packaging slots, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems affecting chip quality, heat dissipation stability, and easy existence of voids, etc., to reduce void content and eliminate voids , the effect of increasing the area of ​​action

Active Publication Date: 2021-12-07
南通鑫晶电子科技有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, when the chip is packaged with epoxy resin, there are likely to be voids in the epoxy resin formed by casting, which will affect its heat dissipation and stability during use, and affect the quality of the chip after packaging

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A transfer type chip packaging device
  • A transfer type chip packaging device
  • A transfer type chip packaging device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] see figure 1 , a transfer-type chip packaging device, including a fixed template 2, a controller is installed on the fixed template 2, the upper end of the fixed template 2 is connected to a movable template 1 through a plurality of cylinders 3, and a pressure module 4 is fixedly connected to the lower end of the movable template 1. A packaging groove corresponding to the pressing module 4 is excavated at the upper end of the template 2, a glue injection tube is fixed through the movable template 1 and the pressing module 4, and a packaging tray 5 is fixedly connected to the inner wall of the packaging groove. There is a transmission magnetic attraction module, and the lower end of the pressing module 4 and the mouth of the packaging tray 5 are all provided with cut corners, and the cut corners of the two match each other, effectively controlling the distance between the pressing module 4 and the chip, and providing a certain amount for the sealing layer. Space.

[004...

Embodiment 2

[0052] see Figure 10 A plurality of through holes corresponding to the moving magnetic balls 832 are excavated on the reorganized moving piece 9, and the lower moving piece 11 is fixedly connected in the through holes, and the lower moving piece 11 is fixedly connected with the moving magnetic ball 832, and the outer magnetic auxiliary ball 831 The upper end is fixedly connected with the upper moving piece 12, and the edge of the upper moving piece 12 is fixedly connected with the reorganized moving piece 9. The reorganized moving piece 9 is a hard plate structure, and the lower moving piece 11 and the upper moving piece 12 are both elastic structures. 7 When the power is turned on, the lower moving piece 11 is deformed downward, and the upper moving piece 12 is deformed upward, so as to realize the redistribution of the molten epoxy resin. It collides with the hard recombined moving piece 9, thereby generating a certain vibration force. On the one hand, it further promotes t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a transfer-type chip packaging device, which belongs to the field of chip packaging. A transfer-type chip packaging device controls two The electromagnetic board is powered on and off, so that the multiple opposite control change ropes gradually receive downward attraction along the direction away from the energized electromagnetic board, and generate a downward pulling force on the recombined moving piece, causing it to deform towards the rubber seal layer. The sealing layer produces a wave-like extrusion force, which collapses the internal voids and forces the molten epoxy resin to redistribute, thereby effectively eliminating the voids. Compared with the existing technology, the void content in the adhesive sealant layer after curing is greatly reduced , to effectively ensure the heat dissipation of the chip after glue sealing and the stability of its use.

Description

technical field [0001] The invention relates to the field of chip packaging, and more specifically, to a transfer-type chip packaging device. Background technique [0002] Packaging can also be said to refer to the housing used to install semiconductor integrated circuit chips. It not only plays the role of placing, fixing, sealing, protecting the chip and enhancing thermal conductivity, but also serves as a bridge between the internal world of the chip and the external circuit - the on-chip The contacts are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, for many integrated circuit products, packaging technology is a very critical part. [0003] In the prior art, when the chip is packaged with epoxy resin, there are likely to be voids in the epoxy resin formed by casting, which will affect its heat dissipation and stability during use, and affect the quality of the p...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B29C39/10B29C39/22B29C39/24B29C39/26H01L21/56
CPCB29C39/10B29C39/22B29C39/24B29C39/26H01L21/56
Inventor 吴斌
Owner 南通鑫晶电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com