Transmission type chip packaging device
A technology of chip packaging and packaging slots, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems affecting chip quality, heat dissipation stability, and easy existence of voids, etc., to reduce void content and eliminate voids , the effect of increasing the area of action
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0043] See figure 1 A chip package transfer means, comprising a fixed platen 2, with a controller mounted on the stationary platen 2, the upper end of the stationary platen 2 by a plurality of cylinders connected to the movable platen 3 with a 1, the lower end of the movable platen 1 is fixedly connected with a pressure module 4, set 2 has an upper end press-cut template module package 4 corresponding to the groove, and the movable platen press 1 through module 4 is fixed to the injection hose, the inner wall of the groove is fixedly connected with a packaging enclosure tray 5, the package and the package tray slot 5 in a space surrounded site there transmitting magnetic indexing module, module pressure plate 4 and a package lower portion opening portion 5 of the chamfer are provided, and both chamfer matched to each other, the effective distance between the control pressure and the chip module 4, to provide a sealing rubber layer Space.
[0044] Further prior art, the disc 5 will...
Embodiment 2
[0052] See Figure 10 Recombinant movable piece cut plurality of through holes respectively corresponding to the moving magnet 832 on the ball 9, fixed to the through hole 11 is connected to the movable piece, the movable piece 11 and the movable magnet 832 is fixedly connected to the ball, the outer magnetic movable secondary ball 831 end fixedly connected to the movable piece 12, movable piece 12 and the upper edge of the movable plate 9 is fixedly connected recombinant, recombinant movable piece 9 of a hard plate-like structure, the movable piece 11 and the movable piece 12 are resilient structure, the electromagnetic tablet 7 is energized, the movable piece 11 at a downwardly deformed at the movable piece 12 upwardly deformed to achieve redistribution of the molten epoxy resin, while when de-energized, the movable plate 12 when the deformation recovery magnetomotive secondary ball 831 generating a hard collision recombinant movable plate 9, so that a certain shock forces, on th...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com