PI film conveying mechanism for carrier tape
A technology of conveying mechanism and laminating mechanism, which is applied in the directions of transportation and packaging, coiling strips, thin material processing, etc., can solve the problems of PI film folding, affecting electroplating effect, PI film crushing, etc., and achieves a simple and compact structure. The effect of improving the plating effect and yield
Active Publication Date: 2021-11-05
APLUS SEMICON TECH CO LTD
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Problems solved by technology
[0002] During the production of the carrier tape, metal circuits need to be made on the PI film, which requires that the surface of the metal circuit on the PI film should not have any damage. The PI film is prone to folding, which makes it unusable. The existing technology uses two upper and lower pressure rollers for transportation. However, this method will cause pressure damage to the area in the middle of the PI film that needs to be made, which will affect the electroplating effect. At the same time, it cannot be eliminated. folding phenomenon
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[0025] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary only for explaining the present invention and should not be construed as limiting the present invention.
[0026] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial" , "radial", "circumferential" and other indicated orientations or positional relationships are based on the orientations or positional relationships shown in the drawings, which are only for the convenience of describing the present ...
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The invention discloses a PI film conveying mechanism for a carrier tape. The PI film conveying mechanism comprises a conveying roller, and a film pressing mechanism, wherein a PI film is conveyed on the conveying roller in a rolling manner, and the conveying roller is tangent to the PI film; the film pressing mechanism is located above the PI film, the film pressing mechanism is used for pressing the PI film on the conveying roller for conveying, and the film pressing mechanism is provided with two pressing wheel assemblies; the two pressing wheel assemblies are symmetrically arranged relative to the PI film; pressing wheels are rotationally arranged on the pressing wheel assemblies, and the pressing wheels are in rolling connection with the edge part of the PI film; the included angle between the plane where the pressing wheels are located and the plane where the PI film is located is an acute angle; and the pressing wheels are used for applying first acting force and second acting force to the PI film, the direction of the first acting force is perpendicular to the plane where the PI film is located, the first acting force points to the conveying roller, the direction of the second acting force is parallel to the plane where the PI film is located, and the second acting force points to the edge part of the PI film from the middle of the PI film. The two pressing wheels can enable the PI film to extend towards the two sides in the conveying process, so that the electroplating effect and the yield are improved.
Description
technical field [0001] The invention belongs to the technical field of conveying equipment, and in particular relates to a PI film conveying mechanism for a carrier tape. Background technique [0002] During the production of the carrier tape, metal circuits need to be made on the PI film, which requires that the surface of the metal circuit on the PI film should not have any damage. The PI film is prone to folding, which makes it unusable. The existing technology uses two upper and lower pressure rollers for transportation. However, this method will cause pressure damage to the area in the middle of the PI film that needs to be made, which will affect the electroplating effect. At the same time, it cannot be eliminated. folding phenomenon. Contents of the invention [0003] The present invention aims to solve at least one of the technical problems existing in the prior art. [0004] Therefore, the present invention proposes a PI film conveying mechanism for a carrier ta...
Claims
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IPC IPC(8): B65H20/02
CPCB65H20/02B65H2404/43
Inventor 蔡水河吕学聪
Owner APLUS SEMICON TECH CO LTD