Multi-station test equipment

Abstract

The invention discloses multi-station test equipment, and aims to provide the multi-station test equipment which is compact in structure and capable of reducing the cost. The equipment comprises a machine table and a black box arranged in the machine table, a test station communicated with the upper end of the black box is arranged on the machine table, a plurality of black card X-axis moving modules are further arranged in the machine table, black cards are correspondingly arranged at the movable ends of the black card X-axis moving modules, the plurality of black cards are sequentially arranged in the black box from top to bottom, and during testing, the corresponding black card X-axis moving modules drive the black cards to move below the test station. The invention is applied to the technical field of chip optical test equipment.

Description

technical field [0001] The invention relates to a multi-station testing device. Background technique [0002] In the optical test of the chip, it is necessary to test the chip through a black card, and the performance of the chip is not the same under different test card distances, and the traditional test equipment adopts a turntable or side-by-side design, which makes Each test distance station needs to set up a separate black box, so there is a situation that the structure is not compact enough, or a large black box structure, but there will be high cost; in addition, in the test process of the chip It also needs to simulate Different ambient light, such as infrared light and other ambient light required by customers, to test the performance of the chip under different simulated light, and the setting of ambient light will further make the overall volume of the device larger, so the current It is necessary to develop a multi-station testing equipment with compact structu...

AI Technical Summary

Problems solved by technology

[0002] In the optical test of the chip, it is necessary to test the chip through a black card, and the performance of the chip is not the same under different test card distances, and the traditional test equipment adopts a turntable or side-by-side design, which makes Each test distance station needs to set up a separate black box, so there is a situation that the structure is not compact enough, or a large black box structure, but there will be high cost; in addition, in the test process of the chip It also needs to simulate Different ambient light, such as infrared light and other ambient light required by customers, to test the performance of the chip under different simulated light, and the setting of ambient light will further make the overall volume of the device larger, so the current It is necessary to develop a compact and cost-effective multi-station testing equipment

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